Arrow Plastic Network Card manual High Speed, High Reliability Interconnects

INTERCONNECT

SOLUTIONS

High Speed, High Reliability Interconnects

Wide selection of board to board and cable assemblies

Samtec

TLS Guide

available!

Samtec makes one of the widest selections of high speed, high reliability, board to board interconnects.

Samtec’s Q-Series®offers the popular Q-Strip®single-ended and Q-Pairs® differential interconnects for high speed, controlled impedance applications. Their design minimises impedance mismatch and crosstalk and optimises capacitance and inductance. Q-Strip and Q-Pairs are available in 0.5mm pitch (QTH, QSH), 0.635mm (QTS, QSS) and 0.8mm pitch (QTE, QSE). The 9.5A rated, integral ground/power plane has SMT leads to save board space. The 0.8mm pitch Q-Pairs carry <8.5GHz per pair rating at -3dB insertion loss.

Second generation, Q2™ high speed interconnects suit rugged applications thanks to greater insertion depth, optional retention pins that almost double the unmating force, guideposts and optional locking screws/holes. All Q2 products offer optional EMI shielding, power pins rated up to 3A per pin and MMCX scale RF connectors.

The ERM8 and ERF8 interconnects use the Edge Rate contact system for smaller pitch and high speed, reduced broadside coupling and capacitance. Rated at 10.5GHz, the system is rugged, handles more mating cycles than other high-speed systems and can be zippered for mating and unmating. They are available in 7mm, 9mm, 10mm, 12mm, 14mm, and 16mm stack heights with <150 pins on a 0.8mm centreline.

High-density array configurations provide high speed, controlled impedance, board to board interfaces with much higher pin counts than traditional strip connectors, increasing board routing flexibility and grounds. The extra pins available for grounding reduce crosstalk, allowing elevated board stacking.

Several footprints, stack heights and contact designs are available to meet a variety of applications. SEARAY®, and HD Mezz* for elevated board stacking, are 1.27 x 1.27 open-pin field arrays that can map as single-ended configurations in differential pairs or a combination. SEARAY and HD Mezz are available from Samtec and Molex. DPArray® has a staggered pin design; perimeter ground

pins reduce the number of grounds needed, providing easier board routing, fewer board layers and more differential pairs per square inch.

Samtec offers Data Rate cable systems for flexibility and high speed. At 31cm length, in single-ended configurations, Data Rate cable assemblies are rated at 2.57GHz (EQCD series) and 1.87GHz (HQCD) at -3dB insertion loss. Maximum performance of these cable assemblies can be higher. These cable assemblies are preferable when an application requires low crosstalk, low EMI emission and susceptibility, higher frequency, less loss or lower voltage drop. They are ideal when mechanical routings are challenging, for high flex and crush life; they suit applications from 200mm to 3m.

* HD Mezz is a trademark of Molex Incorporated

Features

UQ-Strip and Q-Pairs

-0.5mm pitch (QTH, QSH)

-0.635mm (QTS, QSS)

-0.8mm pitch (QTE, QSE)

-9.5A rated, integral ground/power plane

-<8.5GHz rating for 0.8mm pitch Q-Pairs

UERM8 and ERF8 Edge Rate interconnects

-Micro pitch and rugged

-Reduced broadside coupling and capacitance

-Rated at 10.5GHz/pin

-Zipper mating and unmating

-Stack heights 7mm, 9mm, 10mm, 12mm, 14mm and 16mm <150 pins, 0.8mm centreline

UHigh-density arrays

-Controlled impedance, board to board interface

-Higher pin counts increase routing flexibility and grounds

-Extra pins for grounding reduce crosstalk, allow elevated board stacking

-HD Mezz stack heights: 20mm, 25mm, 30mm, 35mm

UData Rate cable assembly

-Rated at 2.57GHz EQCD; 1.87GHz HQCD

UFinal Inch® free tool available: provides optimised interconnect PCB breakout region

Applications

UMedical equipment

UIndustrial applications

UTelecommunications

10 ENQUIRY 1444

For further information, including the TLS Guide, please complete the reply slip or visit http://www.arrowne.com/innov/in219/f_1444.shtml