18 Chapter 1
Hardware Specifications and Configurations
Processor
North Bridge
South Bridge
Item Specification
CPU type Intel® Penryn (dual core)
CPU package Intel® 479 pin Micro-FCPGA
Features Supports Intel architecture with Dynamic execution.
On-die, primary 32-kB instruction cache and 32-kB write-back data
cache.
On-die, up to 6MB second level shared cache with advanced
transfer cache architecture.
S treaming SIMD Extensions 2 (SSE2),S treaming SIMD Extensions
3 (SSE3) Supplemental streaming SIMD extensions 3 (SSSE3)
and SSE4.1 instruction sets.
1066MHz source-synchronous front side bus (FSB)
Advanced power management features includin g Enhanced Intel
SpeedStep® Technology and dynamic FSB frequency switching.
Digital thermal sensor (DTS).
Execute disable bit support for enhanced security.
Intel® Dynamic Acceleration Technology and Enhanced Multi
Threaded Thermal Management (EmTTM).
Support enhance d Intel Virtualization Technology.
CPU core voltage VCC-CORE: Voltage for the future processor will depend on VID0-
6 for battery mode and setting via software for adapter mode for
the future processor
Item Specification
Type Intel Crestline PM965 (North Bridge)
Package FCBGA 1329 balls
Features Processor host bus supports, 667/800/1066MHz FSB support.
Supports Dual Channel DDR2 SDRAM at 667/800 MHz.
Supports Dual Channel DDR3 SDRAM at 800/1066 MHz.
Integrated SDRAM controller up to 8GB (2 SODIMM support)
External Graphics interface for PCI Express Architecture support
DMI x2 and DMI x 4 for connection between GMCH and ICH9M
Supports ACPI 3.0
CPU core voltage 1.05V core, 1.5V,VCCSM(DDR2 = 1.8V/DDR3=1.5V),2.5V,3.3V
Item Specification
Type ICH9M (South Bridge)
Package BGA 676 balls