Asus P6T SE P6T SE Motherboard, P6T SE Motherboard, Qualified Vendors Lists (QVL) DDR3-1067MHzcapability

2 Chapter

P6T SE Motherboard

Qualified Vendors Lists (QVL) DDR3-1333MHz capability (continued)

Vendor	Part No.	Size	SS/	Chip Brand	Chip NO.	Timing	Voltage	DIMM socket support
								(Optional)
			DS			Dimm(Bios)		A*	B*	C*	D*
G.SKILL	F3-10666CL9T-6GBNQ	6GB	DS	N/A	Heat-Sink Package	9-9-9-24	1.5	•	•	•	•
		(Kit of 3)				(1333-9-9-9-24)
KINGMAX	FLFD45F-B8EE9	1GB	SS	ELPIDA	J1108BASE-DJ-E	(1333-9-9-9-24)		•	•	•	•
KINGSTON	KVR1333D3N9/1G	1GB	SS	ELPIDA	J1108BASE-DJ-E	(1333-9-9-9-24) 1.5		•	•	•	•
KINGSTON	KVR1333D3N9/2G	2GB	DS	ELPIDA	J1108BASE-DJ-E	(1333-9-9-9-24)	1.5	•	•	•	•
MICRON	MT8JTF12864AY-	1GB	SS	MICRON	Z9HWR	(1333-9-9-9-24)		•	•	•
	1G4BYES
MICRON	MT16JTF25664AY-	2GB	DS	MICRON	Z9HWR	(1333-9-9-9-24)		•	•	•	•
	1G4BYES
OCZ	OCZ3RPX1333EB2GK	1GB	SS	N/A	Heat-Sink Package	(1066-6-5-5-20)		•	•	•
OCZ	OCZ3X1333GK	3GB	SS	N/A	Heat-Sink Package	7-7-7	1.6	•	•
		(Kit of 3)				(1066-6-6-6-16)
OCZ	OCZ3P13332GK	1GB	DS	N/A	Heat-Sink Package	7-7-7-20		•
						(1333-9-9-9-24)
OCZ	OCZ3P13334GK	4GB	DS	N/A	Heat-Sink Package	7 (1333-7-7-7-20)	1.8	•	•	•	•
		(Kit of 2)
OCZ	OCZ3RPX1333EB4GK	4GB	DS	N/A	Heat-Sink Package	(1066-6-5-5)	1.85	•	•
		(Kit of 2)
Qimonda	IMSH1GU03A1F1C-13H	1GB	SS	Qimonda	IDSH1G-03A1F1C-	9 (1333-9-9-9-24)		•	•	•	•
					13H
Qimonda	IMSH2GU13A1F1C-13H	2GB	DS	Qimonda	IDSH1G-03A1F1C-	9 (1333-9-9-9-24)		•	•	•	•
					13H
SAMSUNG	M378B2873DZ1-CH9	1GB	SS	SAMSUNG	K4B1G0846D	9 (1333-9-9-9-24)		•	•	•	•
SAMSUNG	M391B2873DZ1-CH9	1GB	SS	SAMSUNG	K4B1G0846D(ECC)	9 (1333-9-9-9-24)		•	•	•	•
SAMSUNG	M378B5673DZ1-CH9	2GB	DS	SAMSUNG	K4B1G0846D	9 (1333-9-9-9-24)		•	•	•	•
SAMSUNG	M391B5673DZ1-CH9	2GB	DS	SAMSUNG	K4B1G0846D(ECC)	9 (1333-9-9-9-24)		•	•	•	•
Transcend	TS128MLK64V3U	1GB	SS	SAMSUNG	K4B1G0846D	9 (1333-9-9-9-24)		•	•	•	•
Transcend	TS256MLK64V3U	2GB	DS	SAMSUNG	K4B1G0846D	9 (1333-9-9-9-24)		•	•	•	•
Asint	SLY3128M8-EDJ	1GB	SS	Asint	DDRIII1208-DJ	(9-9-9-24)				•	•
Asint	SLZ3128M8-EDJ	2GB	DS	Asint	DDRIII1208-DJ	(9-9-9-24)		•	•	•	•
BUFFALO	FSX1333D3G-1G	1GB	SS	N/A	Heat-Sink Package	(1066-7-7-7-20)		•	•	•	•
BUFFALO	FSX1333D3G-2G	2GB	DS	N/A	Heat-Sink Package	(1066-7-7-7-20)		•	•	•	•
Elixir	M2F2G64CB8HA4N-CG	2GB	DS	Elixir	N2CB1G80AN-CG	(1333-9-9-9-24)		•	•	•	•
Patriot	PDC32G1333LLK	1GB	SS	PATRIOT	Heat-Sink Package	7 (1337-7-7-7-20)	1.7	•	•	•	•
Patriot	PVT33G1333ELK	3GB	SS	N/A	Heat-Sink Package	CL9-9-9-24	1.65	•	•	•	•
		(Kit of 3)				(1066-7-7-7-20)
Patriot	PVT36G1333ELK	6GB	DS	N/A	Heat-Sink Package	CL9-9-9-24	1.65	•	•	•	•
		(Kit of 3)				(1066-7-7-7-20)
PQI	MFACR322LA0105	1GB	DS	PQI	PQC3648S15R	(1333-9-9-9-24)		•	•	•	•

P6T SE Motherboard

Qualified Vendors Lists (QVL) DDR3-1067MHz capability

Vendor	Part No.	Size	SS/	Chip Brand	Chip NO.	Timing DIMM	Voltage	DIMM socket support
								(Optional)
			DS			(BIOS)		A*	B*	C*	D*
CORSAIR	CM3X1024-1066C7	1GB	DS	N/A	Heat-Sink Package	7	1.1	•	•
Crucial	CT12864BA1067.8SFB	1GB	SS	MICRON	Z9HWQ	7		•	•	•	•
Crucial	CT12864BA1067.8SFD	1GB	SS	MICRON	D9JNL	7		•	•	•	•
Crucial	CT25664BA1067.16SFD	2GB	DS	MICRON	D9JNL	7		•	•	•	•
ELPIDA	EBJ10UE8BAW0-AE-E	1GB	SS	ELPIDA	J1108BABG-DJ-E	CL7		•	•	•	•
						(1066-7-7-7-20)
ELPIDA	EBJ11RD8BAFA-AE-E	1GB	DS	ELPIDA	J5308BASE-AC-E (ECC)	7		•	•	•	•
ELPIDA	EBJ11UD8BAFA-AG-E	1GB	DS	ELPIDA	J5308BASE-AC-E	8		•	•	•
ELPIDA	EBJ21UE8BAW0-AE-E	2GB	DS	ELPIDA	J1108BABG-DJ-E	CL7		•	•	•	•
						(1066-7-7-7-20)
		2GB
G.SKILL	F3-8500CL6D-2GBHK		SS	N/A	Heat-Sink Package	6-6-6-15	1.65	•	•	•	•
		(Kit of 2)
Hynix	HMT112U6AFP8C-G7N0	1GB	SS	HYNIX	H5TQ1G83AFPG7C	7		•	•	•	•
Hynix	HYMT112U64ZNF8-G7	1GB	SS	HYNIX	HY5TQ1G831ZNFP-G7	7		•	•	•
Hynix	HMT125U6AFP8C-G7N0	2GB	DS	HYNIX	H5TQ1G83AFPG7C	7		•	•	•	•
Hynix	HYMT125U64ZNF8-G7	2GB	DS	HYNIX	HY5TQ1G831ZNFP-G7	7		•	•	•
KINGSTON	KVR1066D3N7/1G	1GB	DS	ELPIDA	J5308BASE-AC-E		1.5	•	•	•	•
KINGSTON	KVR1066D3N7/2G	2GB	DS	SAMSUNG	K4B1G0846C-ZCF8		1.5	•	•	•	•
MICRON	MT8JTF12864AY-1G1D1	1GB	SS	MICRON	7VD22	7		•	•	•	•

2-14 Chapter 2: Hardware information