3.Remove the heat sink (2). The heat sink bracket (3) is built into the system board.

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and processor each time the heat sink is removed. Thermal paste is applied to the fan/heat sink assembly to correspond with components on the system board as follows: the processor (1), and the Northbridge chip (2). Thermal pads and thermal paste are included with all heat sink, system board, and processor spare part kits.

Reverse this procedure to install the fan/heat sink assembly.

Remove the discrete heat sink:

1.Turn the system board upside down.

2.Loosen the 5 Phillips PM2.0×5.0 captive screws (1) that secure the heat sink to the system board.

NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach the assembly.

82 Chapter 4 Removal and replacement procedures

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Compaq G71, CQ71 manual