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| CY62137EV30 |
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| MoBL® |
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Pin Configurations[2, 3] |
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| VFBGA (Top View) | 44 TSOP II (Top View) | ||
1 | 2 | 3 | 4 | 5 | 6 |
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BLE | OE | A0 | A1 | A2 | NC | A |
I/O8 | BHE | A3 | A4 | CE | I/O0 | B |
I/O9 | I/O10 | A5 | A6 | I/O1 | I/O2 | C |
VSS | I/O11 | NC | A7 | I/O3 | Vcc | D |
VCC | I/O | NC | A16 | I/O | Vss | E |
| 12 |
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| 4 |
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I/O14 | I/O13 | A14 | A15 | I/O5 | I/O6 | F |
I/O | NC | A | A13 | WE | I/O | G |
15 |
| 12 |
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| 7 |
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NC | A8 | A9 | A10 | A11 | NC | H |
A4 
A3 ![Pin Configurations[2, 3]](/images/new-backgrounds/136325/1363253xi3.webp){kind=small}
A2 
A1 
A0 
CE 
I/O0 
I/O1 
I/O2 
I/O3 
VCC 
VSS 
I/O4 
I/O5 
I/O6 
I/O7 
WE 
A16 
A15
A14 
A13
A12 
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44 
A5
43 
A6
42 
A7
41 
OE
40 
BHE
39 
BLE
38 
I/O15
37 
I/O14
36 
I/O13
35 
I/O12
34 
VSS
33 
VCC
32 
I/O11
31 
I/O10
30 
I/O9
29 
I/O8
28 
NC
27 
A8
26 
A9
25 
A10
24 
A11
23 
NC
Product Portfolio
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| Speed |
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| Power Dissipation |
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Product |
| VCC Range (V) |
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| Operating ICC (mA) |
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| (ns) |
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| Standby ISB2 (∝A) | |||||||||
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| f = 1MHz | f = fmax |
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| Min. |
| Typ.[7] |
| Max. |
| Typ.[7] |
| Max. | Typ.[7] |
| Max. |
| Typ.[7] | Max. |
2.2V |
| 3.0V |
| 3.6V | 45 ns | 2 |
| 2.5 | 15 |
| 20 |
| 1 | 7 | |
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Note: |
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2.NC pins are not connected on the die.
3.Pins D3, H1, G2, and H6 in the BGA package are address expansion pins for 4 Mb, 8 Mb, 16 Mb, and 32 Mb, respectively.
Document #: | Page 2 of 12 |
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