CY62146E MoBL®
Document Number: 001-07970 Rev. *D Page 3 of 11
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature..................................–65°C to +150°C
Ambient Temperature with
Power Applied............................................ –55°C to +125°C
Supply Voltage to Ground Potential..................–0.5V to 6.0V
DC Voltage Applied to Outputs
in High-Z State [3, 4]..........................................–0.5V to 6.0V
DC Input Voltage [3, 4].......................................–0.5V to 6.0V
Output Current into Outputs (LOW).............................20 mA
Static Discharge Voltage............................................>2001V
(MIL-STD-883, Method 3015)
Latch up Current......................................................>200 mA
Operating Range
Device Range Ambient
Tempe ratur e VCC [5]
CY62146ELL Ind’l/Auto-A –40°C to +85°C 4.5V–5.5V
Electrical Characteristics
Over the Operating Range
Parameter Description Test Conditions
45 ns (Ind’l/Auto-A)
UnitMin Typ [2] Max
VOH Output HIGH Voltage IOH = –1.0 mA 2.4 V
VOL Output LOW Voltage IOL = 2.1 mA 0.4 V
VIH Input HIGH Voltage 4.5 < VCC < 5.5 2.2 VCC + 0.5 V
VIL Input LOW Voltage 4.5 < VCC < 5.5 –0.5 0.8 V
IIX Input Leakage Current GND < VI < VCC –1 +1 μA
IOZ Output Leakage Current GND < VO < VCC, Output Disabled –1 +1 μA
ICC VCC Operating Supply
Current
f = fmax = 1/tRC VCC = VCCmax
IOUT = 0 mA, CMOS levels
15 20 mA
f = 1 MHz 2 2.5
ISB2 [6] Automatic CE Power
down Current — CMOS
Inputs
CE > VCC – 0.2V, VIN > VCC – 0.2V or VIN < 0.2V,
f = 0, VCC = VCC(max)
17μA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VCC = VCC(typ)
10 pF
COUT Output Capacitance 10 pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions TSOP II Unit
ΘJA Thermal Resistance
(Junction to Ambient) Still Air, soldered on a 3 × 4.5 inch, two layer
printed circuit board 77 °C/W
ΘJC Thermal Resistance
(Junction to Case) 13 °C/W
Notes
3. VIL(min) = –2.0V for pulse durations less than 20 ns for I < 30 mA.
4. VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.
5. Full Device AC operation assumes a minimum of 100 μs ramp time from 0 to VCC (min) and 200 μs wait time after VCC stabilization.
6. Only chip enable (CE) and byte enables (BHE and BLE) is tied to CMOS levels to meet the I SB2 / ICCDR spec. Other inputs are left floating.
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