Package Diagrams
16
CY62148BN MoBL®
32-lead (450-Mil) Molded SOIC (51-85081)
1
0.546[13.868]
0.566[14.376]
0.440[11.176] | DIMENSIONS IN INCHES[MM] | MIN. |
0.450[11.430] |
MAX.
PACKAGE WEIGHT 1.42gms
17
0.101[2.565]
0.111[2.819]
0.050[1.270]
BSC.
| 32 |
0.793[20.142] |
|
0.817[20.751] | 0.006[0.152] |
| 0.012[0.304] |
0.118[2.997]
MAX.
0.004[0.102]
0.004[0.102]
MIN.
0.014[0.355]
0.020[0.508]
SEATING PLANE
PART #
S32.45 STANDARD PKG.
SZ32.45 LEAD FREE PKG.
0.047[1.193]
0.063[1.600]
0.023[0.584]
0.039[0.990]
32-Lead Thin Small Outline Package Type II (51-85095)
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