CY62158EV30 MoBL®
Document #: 38-05578 Rev. *D Page 4 of 11
Thermal Resistance[9]
Parameter Description Test Conditions BGA TSOP II Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch,
two-layer printed circuit board
72 76.88 °C/W
ΘJC Thermal Resistance
(Junction to Case)
8.86 13.52 °C/W
AC Test Loads and Waveforms
VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT VTH
Equivalent to: THÉ VENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
Fall time: 1 V/ns
Rise Time: 1 V/ns
Parameters 2.5V 3.0V Unit
R1 16667 1103
R2 15385 1554
RTH 8000 645
VTH 1.20 1.75 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ[4] Max Unit
VDR VCC for Data Retention 1.5 V
ICCDR[8] Data Retention Current VCC = 1.5V, CE1 > VCC 0.2V
or CE2 < 0.2V, VIN > VCC 0.2V
or VIN < 0.2V
25µA
tCDR[9] Chip Deselect to Data
Retention Time
0ns
tR[10] Operation Recovery
Time
tRC ns
Data Retention Waveform
VCC, min
VCC, min
tCDR
VDR >1.5V
tR
CE1
VCC
CE2
DATA RETENTION MODE
or
Note
10.Full Device AC operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
[+] Feedback