Cypress CY62158EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Characteristics, Data Retention Waveform

CY62158EV30 MoBL®

Document #: 38-05578 Rev. *D Page 4 of 11

Thermal Resistance[9]

Parameter Description Test Conditions BGA TSOP II Unit

ΘJA Thermal Resistance

(Junction to Ambient)

Still Air, soldered on a 3 x 4.5 inch,

two-layer printed circuit board

72 76.88 °C/W

ΘJC Thermal Resistance

(Junction to Case)

8.86 13.52 °C/W

AC Test Loads and Waveforms

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

OUTPUT VTH

Equivalent to: THÉ VENIN EQUIVALENT

ALL INPUT PULSES

RTH

Fall time: 1 V/ns

Rise Time: 1 V/ns

Parameters 2.5V 3.0V Unit

R1 16667 1103 Ω

R2 15385 1554 Ω

RTH 8000 645 Ω

VTH 1.20 1.75 V

Data Retention Characteristics (Over the Operating Range)

Parameter Description Conditions Min Typ[4] Max Unit

VDR VCC for Data Retention 1.5 V

ICCDR[8] Data Retention Current VCC = 1.5V, CE1 > VCC − 0.2V

or CE2 < 0.2V, VIN > VCC − 0.2V

or VIN < 0.2V

25µA

tCDR[9] Chip Deselect to Data

Retention Time

0ns

tR[10] Operation Recovery

Time

tRC ns

Data Retention Waveform

VCC, min

tCDR

VDR >1.5V

CE1

VCC

CE2

DATA RETENTION MODE

Note

10.Full Device AC operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.

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