CY7C1019D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Switching Characteristics (Over the Operating Range) [5]

 

 

 

 

Parameter

 

 

 

 

 

 

Description

–10 (Industrial)

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Read Cycle

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tpower [6]

 

VCC(typical) to the first access

100

 

 

µs

tRC

 

Read Cycle Time

10

 

 

ns

tAA

 

Address to Data Valid

 

10

 

ns

tOHA

 

Data Hold from Address Change

3

 

 

ns

tACE

 

 

 

 

LOW to Data Valid

 

10

 

ns

CE

 

tDOE

 

 

 

 

LOW to Data Valid

 

5

 

ns

OE

 

tLZOE

 

 

 

 

LOW to Low Z

0

 

 

ns

OE

 

tHZOE

 

 

 

 

HIGH to High Z [7, 8]

 

5

 

ns

OE

 

tLZCE

 

 

 

LOW to Low Z [8]

3

 

 

ns

CE

 

tHZCE

 

 

 

HIGH to High Z [7, 8]

 

5

 

ns

CE

 

tPU [9]

 

 

 

LOW to Power-Up

0

 

 

ns

CE

 

tPD [9]

 

 

 

HIGH to Power-Down

 

10

 

ns

CE

 

Write Cycle [10, 11]

 

 

 

 

 

 

 

 

 

 

 

tWC

 

Write Cycle Time

10

 

 

ns

tSCE

 

 

 

LOW to Write End

7

 

 

ns

CE

 

tAW

 

Address Set-Up to Write End

7

 

 

ns

tHA

 

Address Hold from Write End

0

 

 

ns

tSA

 

Address Set-Up to Write Start

0

 

 

ns

tPWE

 

 

 

 

Pulse Width

7

 

 

ns

WE

 

tSD

 

Data Set-Up to Write End

6

 

 

ns

tHD

 

Data Hold from Write End

0

 

 

ns

tLZWE

 

 

 

 

HIGH to Low Z [8]

3

 

 

ns

WE

 

tHZWE

 

 

 

 

LOW to High Z [7, 8]

 

5

 

ns

WE

 

Notes

5.Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance.

6.tPOWER gives the minimum amount of time that the power supply should be at typical VCC values until the first memory access can be performed.

7.tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in (c) of “AC Test Loads and Waveforms [4]” on page 4. Transition is measured when the outputs enter a high impedance state.

8.At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.

9.This parameter is guaranteed by design and is not tested.

10.The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.

11.The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.

Document #: 38-05464 Rev. *E

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Cypress CY7C1019D manual Parameter Description Industrial Unit Min Max Read Cycle

CY7C1019D specifications

The Cypress CY7C1019D is a high-performance static random-access memory (SRAM) chip designed for various applications requiring fast and reliable memory solutions. This RAM chip is particularly noted for its high-speed performance, low power consumption, and versatility, making it suitable for a wide range of electronic devices and systems.

One of the main features of the CY7C1019D is its fast access time, which typically ranges from 10 ns to 15 ns. This rapid access time allows for efficient data processing and fast response times in applications such as telecommunications, networking, and consumer electronics. The chip operates at standard voltages of 2.7V to 3.6V, ensuring compatibility with modern low-voltage systems while also reducing power consumption.

Another noteworthy characteristic of the CY7C1019D is its density of 1 Megabit, organized in a 128K x 8 architecture. This configuration provides ample memory space for various data storage needs, whether in embedded systems, automotive applications, or high-speed buffering. The SRAM's structure allows for simultaneous read and write operations, enhancing overall system performance.

The CY7C1019D employs advanced CMOS technology, which contributes to its low power operation. This feature is crucial for battery-powered devices and applications where energy efficiency is a priority. The chip supports a range of operating temperatures, making it suitable for both consumer and industrial applications.

Moreover, the CY7C1019D includes various useful features such as a fast burst mode for high-speed data transfer, and it supports asynchronous data rates, enhancing its adaptability across different platforms. Its simple interface allows for easy integration into existing system architectures.

The package options for the CY7C1019D include both 32-pin and 44-pin flat packages, making it accessible for different PCB layouts and design requirements. This flexibility further contributes to its wide usage in various industries, including automotive, telecommunications, and industrial control systems.

In conclusion, the Cypress CY7C1019D SRAM chip stands out as a reliable, high-speed memory component, ideal for applications demanding quick access and efficient data management. Its combination of speed, low power consumption, and versatility makes it a preferred choice for designers looking to enhance system performance and reliability.