CY7C1334H
Document #: 38-05678 Rev. *B Page 7 of 13

Maximum Rating

(Above which the useful life may be impaired. For user guide-
lines not tested.)
Storage Temperature .....................................− 65°C to +150°C
Ambient Temperature with
Power Applied.................................................. −55°C to +125°C
Supply Voltage on VDD Relative to GND.........−0.5V to +4.6V
Supply Voltage on VDDQ Relative to GND.......−0.5V to +VDD
DC Voltage Applied to Outputs
in Tri-State................................................−0.5V to VDDQ + 0.5V
DC Input Voltage....................................... −0.5V to VDD + 0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA

Operating Range

Range Ambient
Temperature (TA) VDD VDDQ
Com’l 0°C to +70°C 3.3V - 5%/+10% 2.5V - 5% to
VDD
Ind’l –40°C to +85°C
Electrical Characteristics Over the Operating Range[9, 10]
Parameter Description Test Conditions Min. Max. Unit
VDD Power Supply Voltage 3.135 3.6 V
VDDQ I/O Supply Voltage for 3.3V I/O 3.135 VDD V
for 2.5V I/O 2.375 2.625 V
VOH Output HIGH Voltage for 3.3V I/O, IOH = –4.0 mA 2.4 V
for 2.5V I/O, IOH = –1.0 mA 2.0
VOL Output LOW Voltage for 3.3V I/O, IOL = 8.0 mA 0.4 V
for 2.5V I/O, IOL = 1.0 mA 0.4
VIH Input HIGH Voltage[9] for 3.3V I/O 2.0 VDD + 0.3V V
for 2.5V I/O 1.7 VDD + 0.3V
VIL Input LOW Voltage[9] for 3.3V I/O –0.3 0.8 V
for 2.5V I/O –0.3 0.7
IXInput Leakage Current
except ZZ and MODE GND VI VDDQ –5 5µA
Input Current of MODE Input = VSS 30 µA
Input = VDD 5µA
Input Current of ZZ Input = VSS 5µA
Input = VDD 30 µA
IOZ Output Leakage Current GND VI VDDQ, Output Disabled 5 5 µA
IDD VDD Operating Supply
Current VDD = Max., IOUT = 0 mA,
f = fMAX = 1/tCYC
6-ns cycle, 166 MHz 240 mA
7.5-ns cycle, 133 MHz 225 mA
ISB1 Automatic CE
Power-Down
Current—TTL Inputs
VDD = Max, Device
Deselected,
VIN VIH or VIN VIL
f = fMAX = 1/tCYC
6-ns cycle, 166 MHz 100 mA
7.5-ns cycle, 133 MHz 90 mA
ISB2 Automatic CE
Power-Down
Current—CMOS Inputs
VDD = Max, Device
Deselected, VIN 0.3V or
VIN > VDDQ – 0.3V, f = 0
All speeds 40 mA
ISB3 Automatic CE
Power-Down
Current—CMOS Inputs
VDD = Max, Device
Deselected, or VIN 0.3V or
VIN > VDDQ – 0.3V
f = fMAX = 1/tCYC
6-ns cycle, 166 MHz 85 mA
7.5-ns cycle, 133 MHz 75 mA
ISB4 Automatic CE
Power-Down
Current—TTL Inputs
VDD = Max, Device
Deselected,
VIN VIH or VIN VIL, f = 0
All Speeds 45 mA
Notes:
9. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2).
10.TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
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