Pin Definitions

 

 

 

 

 

 

 

 

CY7C1353G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Name

IO

 

 

 

 

Description

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A0, A1, A

Input-

 

Address Inputs used to select one of the 256K address locations. Sampled at the rising edge

 

 

 

 

 

 

 

 

 

Synchronous

 

of the CLK. A[1:0] are fed to the two-bit burst counter.

 

 

 

 

 

 

 

 

 

 

 

 

[A:B]

Input-

 

Byte Write Inputs, Active LOW. Qualified with

 

to conduct writes to the SRAM. Sampled on

 

 

BW

WE

 

 

 

 

 

 

 

 

 

Synchronous

 

the rising edge of CLK.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

 

Write Enable Input, Active LOW. Sampled on the rising edge of CLK if

 

is active LOW. This

 

 

WE

CEN

 

 

 

 

 

 

 

 

 

Synchronous

 

signal must be asserted LOW to initiate a write sequence.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

 

Advance/Load Input. Used to advance the on-chip address counter or load a new address. When

 

 

ADV/LD

 

 

 

 

 

 

 

 

 

 

 

Synchronous

 

HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new

 

 

 

 

 

 

 

 

 

 

 

address can be loaded into the device for an access. After being deselected, ADV/LD must be

 

 

 

 

 

 

 

 

 

 

 

driven LOW to load a new address.

 

 

 

 

 

 

 

 

 

CLK

Input-Clock

 

Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with

 

CLK

 

 

CEN.

 

 

 

 

 

 

 

 

 

 

 

is only recognized if CEN is active LOW.

 

 

 

 

 

 

 

 

 

 

1

 

Input-

 

Chip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with

 

 

CE

 

 

 

 

 

 

 

 

 

Synchronous

 

CE2, and CE3 to select/deselect the device.

 

 

 

 

 

 

 

 

 

CE2

Input-

 

Chip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with

 

 

 

 

 

 

 

 

 

Synchronous

 

CE1 and CE3 to select/deselect the device.

 

 

 

 

 

 

 

 

 

 

3

 

Input-

 

Chip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with

 

 

CE

 

 

 

 

 

 

 

 

 

Synchronous

 

CE1 and CE2 to select/deselect the device.

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

 

Output Enable, asynchronous input, Active LOW. Combined with the synchronous logic block

 

 

OE

 

 

 

 

 

 

 

 

 

Asynchronous

 

inside the device to control the direction of the IO pins. When LOW, the IO pins are allowed to

 

 

 

 

 

 

 

 

 

 

 

behave as outputs. When deasserted HIGH, IO pins are tri-stated, and act as input data pins.

OE

 

 

 

 

 

 

 

 

 

 

 

 

is masked during the data portion of a write sequence, during the first clock when emerging from

 

 

 

 

 

 

 

 

 

 

 

a deselected state, when the device has been deselected.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

 

Clock Enable Input, Active LOW. When asserted LOW the Clock signal is recognized by the

 

 

CEN

 

 

 

 

 

 

 

 

 

Synchronous

 

SRAM. When deasserted HIGH the Clock signal is masked. While deasserting CEN does not

 

 

 

 

 

 

 

 

 

 

 

deselect the device, CEN can be used to extend the previous cycle when required.

 

 

ZZ

Input-

 

ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition

 

 

 

 

 

 

 

 

 

Asynchronous

 

with data integrity preserved. During normal operation, this pin has to be low or left floating. ZZ pin

 

 

 

 

 

 

 

 

 

 

 

has an internal pull down.

 

 

 

 

 

 

 

 

 

DQs

IO-

 

Bidirectional Data IO Lines. As inputs, they feed into an on-chip data register that is triggered by

 

 

 

 

 

 

 

 

 

Synchronous

 

the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified

 

 

 

 

 

 

 

 

 

 

 

by address during the clock rise of the read cycle. The direction of the pins is controlled by OE and

 

 

 

 

 

 

 

 

 

 

 

the internal control logic. When

OE

is asserted LOW, the pins can behave as outputs. When HIGH,

 

 

 

 

 

 

 

 

 

 

 

DQs and DQP[A:B] are placed in a tri-state condition. The outputs are automatically tri-stated during

 

 

 

 

 

 

 

 

 

 

 

the data portion of a write sequence, during the first clock when emerging from a deselected state,

 

 

 

 

 

 

 

 

 

 

 

and when the device is deselected, regardless of the state of OE.

 

 

 

 

 

 

 

 

 

DQP[A:B]

IO-

 

Bidirectional Data Parity IO Lines. Functionally, these signals are identical to DQs. During write

 

 

 

 

 

 

 

 

 

Synchronous

 

sequences, DQP[A:B] is controlled by BWx correspondingly.

 

 

 

 

 

 

 

 

 

MODE

Input

 

MODE Input. Selects the burst order of the device.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Strap Pin

 

When tied to Gnd selects linear burst sequence. When tied to VDD or left floating selects interleaved

 

 

 

 

 

 

 

 

 

 

 

burst sequence.

 

 

 

 

 

 

 

 

 

VDD

Power Supply

 

Power supply inputs to the core of the device.

 

 

 

 

 

 

 

 

 

VDDQ

IO Power

 

Power supply for the IO circuitry.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Supply

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VSS

Ground

 

Ground for the device.

 

 

 

 

 

 

 

 

 

NC,NC/9M,

 

No Connects. Not internally connected to the die. NC/9M, NC/18M, NC/72M, NC/144M, NC/288M,

 

 

NC/18M,

 

 

are address expansion pins are not internally connected to the die.

 

 

 

 

 

 

 

 

 

NC/36M

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NC/72M,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NC/144M,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NC/288M,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Document #: 38-05515 Rev. *E

 

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Cypress CY7C1353G manual Pin Definitions