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Processor Heat Sink
Dell™Inspiron™1440ServiceManual
Removing the Processor Heat Sink
Replacing the Processor Heat Sink

Removing the Processor Heat Sink

1. Follow the procedures in Before You Begin.
2. Follow the procedures from step 2 to step 16 in Removing the System Board.
3. Disconnect the fan cable from the connector on the system board.
4. In sequential order (indicated on the processor heat sink), loosen the five captive screws that secure the processor heat sink to the system board.
5. Lift the processor heat sink off the computer.

Replacing the Processor Heat Sink

1. Align the five captive screws on the processor heat sink with the screw holes on the system board and tighten the screws in descending order.
2. Connect the fan cable to the connector on the system board.
3. Follow the procedures from step 4 to step 19 in Replacing the System Board.
WARNING: Before working inside your computer, read the safety information that shipped with your computer. For additional safety best
practices information, see the Regulatory Compliance Homepage at www.dell.com/regulatory_compliance.
WARNING: If you remove the processor heat sink from the computer when the heat sink is hot, do not touch the metal housing of the processor
heat sink.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching an unpainted metal
surface (such as the back panel) on the computer.
CAUTION: Onlyacertifiedservicetechnicianshouldperformrepairsonyourcomputer.DamageduetoservicingthatisnotauthorizedbyDell™
is not covered by your warranty.
CAUTION: To help prevent damage to the system board, remove the main battery (see Removing the Battery) before working inside the
computer.
1
processor heat sink
2
fan cable connector
3
captive screws (5)
NOTE: The original thermal pad can be reused if the original processor and heat sink are reinstalled together. If either the processor or heat sink is
replaced, use the thermal pad provided in the kit to ensure that thermal conductivity is achieved.