7. Product Specifications
■General specifications
Table 3 lists the general specifications of the header board.
Table 3 General Specifications
Item | Description | |
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Operating temperature and storage temperature | 5 °C to 35 °C (operation) , 0 °C to 40 °C (storage) | |
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Operating humidity and storage humidity | 20 % to 80 % (operation) , 20 % to 80 % (storage) | |
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Dimensions | Approximately 40 mm ⋅ 40 mm ⋅ 16 mm | |
(Height contains that of YQPACK and NQPACK) | ||
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■Main part
The main part of a header board is shown in Table 4.
| Table 4 Main Part | |
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Name | Description | |
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| 120 pin, 0.5 mm pitch, | |
MCU board I/F connector | (straight) ⋅ 2 | |
[Model number : | ||
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| (from Japan Aviation Electronics Industry, Limited) ] | |
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| 2 pin, 2.54 mm pitch, | |
Incorrect insertion prevention socket | (Straight) | |
| [Model number : | |
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| Socket | |
User target system I/F connector | 52 pin, 0.65 mm pitch | |
| [Model number : YQPACK052SB (from Tokyo Eletech Corporation) ] | |
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■Functional block diagram
A header board performs socket conversion between the MCU board I/F connector and YQPACK. The header board does not contain any component such as an IC internally. Figure 7 shows the block diagram.
MCU board I/F connector
User target system I/F connector (Socket for package)
Figure 7 Functional Block Diagram
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