![1. Product Outline](/images/new-backgrounds/112083/1120837x1.webp)
1. Product Outline
■Product outline
MCU board
㪤㪙㪉㪈㪋㪍㪄㪇㪐 |
BGM adapter
Header board
Figure 1 System Configuration
■Product configuration
Table 1 lists the product configuration in the header board, and Table 2 lists options.
Table 1 Product Cofiguration
Name |
| Description |
| Remarks | |
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Connector/LQFP52pin |
| - | |||
header board | (0.65 mm pitch) Package conversion | ||||
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[Model number : |
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[Model number : YQPACK052SB] | I/F between header board and NQPACK | Accessory (connected) | |||
(Tokyo Eletech Corporation) | |||||
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[Model number : NQPACK052SB] | For mounted on user system |
| Accessory | ||
(Tokyo Eletech Corporation) |
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[Model number : HQPACK052SB] | Used when mounting mass production MCU | Accessory | |||
(Tokyo Eletech Corporation) | to NQPACK. |
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| Table 2 Options |
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Name |
| Description |
| Remarks | |
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BGM adapter |
| ICE unit for |
| - | |
[Model number : |
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MCU board |
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[Model number : |
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*: Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies the service conditions.
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