Henkel SubFloor manual Technical guide, Laying procedure for tiles

Models: SubFloor

1 8
Download 8 pages 25.86 Kb
Page 2
Image 2
Laying procedure for tiles

Technical guide

Technical guide

 

 

 

Laying procedure for tiles

Hardness

Use cement based products for subfloor preparation. They must be neither crumbly nor flaky.

Flatness

Maximum deflexion, for a 2 m ruler 7 mm, for a 0.20 m ruler 2 mm.

Surface state: fine and regular.

Dryness

Moisture content in subfloors should be measured using appropriate devices and should be in accordance with relevant standards in each country. The relative humidity must not be higher than 75 % R.H.

Adapt the drying time according to how cold or damp the conditions are.

Smoothness

A smoothing compound must be applied to the entire surface according to the standards mentioned above. Smoothing compounds are not designed to overcome levelling deficiencies. The smoothing compound must be allowed to dry in accordance with manufacturer's instructions.

Rub down using a carborundum stone in order to obtain a perfectly smooth surface. Sweep or vacuum up any dust. Spread the adhesive.

Expansion joints or movement joints

Floorcovering should be laid up to the joint and the joint should be covered with an appropriate plastic or metal sliding joint cover.

Subfloors direct to ground

A damp-proof membrane must be laid under the concrete to act as a waterproof barrier against underlying hydrostatic pressure and moisture.

Underfloor heating

The subfloor must be allowed to dry in accordance with local standards.

The heating system should have been switched on at least 4 weeks before laying the floorcovering, then switched off 24 hours before any subfloor preparation, and remains switched off during installation of the floorcovering. The heating should then be switched on 48 hours after installation of the flooring and the temperature progressively increased to normal working temperatures over 5-7 days.

Glueline temperature < 28 °C (contact technical department for further information.)

Old carpeting

Remove, clean the subfloor and apply a smoothing compound.

Wooden floorboards

Check the condition of the floorboards, secure any loose boards.

Any knotholes to be filled as necessary.

Cover with hardboard, chipboard or plywood, minimum thickness 8 mm.

These sheets should be nailed or stapled every 10-15 cms.

Check that the floorboards are dry and ventilated on the underside.

All non ventilated woodenfloors must be removed.

Ceramic tiles

Any loose tiles must be stuck down and any traces of paint, plaster, grease, etc, must be removed. The cleaned tiles must be primed with an appropriate primer prior to applying a smoothing compound fully in accordance with manufacturers instructions.

Leave to dry then rub down to a smooth finish.

Sweep thoroughly. Apply the adhesive in accordance with manufacturers instructions.

Old vinyl flooring

Old vinyl, linoleum and rubber floorcoverings should always be removed and the subfloor be examined and prepared as necessary before installing new floorcoverings.

Technical

guide

170

 

 

Unpack the tiles 24 hours before laying and make sure they are stacked horizontally.

Manual background Minimum ambiant temperature must be 15 °C.

1.Trace a line perpendicular to the main entrance.

Trace a perpendicular line to this axis ensuring equal cuts for tiles on both sides.

2.Apply adhesive to a few square metres of subfloor in one quarter.

Manual background Insufficient open time of the adhesive will cause bubbles.

If open time is too long the adhesive transfer will be poor.

3.Press each tile into position ensuring joints are butted tight.

Manual background Beware installation directions according to pattern.

4.Smooth down manually then roll with a 50 kg flooring roller.

5.If necessary heat weld seams 24 hours after installation.

Manual background Do not traffic the floorcovering for 48 hours after installation.

171

Technical guide

 

Page 2
Image 2
Henkel SubFloor manual Technical guide, Laying procedure for tiles