Product End-of-Life Disassembly Instructions

Marketing Name / Model


[List multiple models if applicable.]

Product Category

HP Omni100 PC

Integrated PC











Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment.

1.0 Items Requiring Selective Treatment

1.1Items listed below are classified as requiring selective treatment.

1.2Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.


Item Description






Quantity of items







included in product











Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)



With a surface greater than 10 sq cm








All types including standard alkaline and lithium coin or button style


















Mercury-containing components



For example, mercury in lamps, display backlights, scanner lamps,









switches, batteries






Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm


Includes background illuminated displays with gas discharge lamps












Cathode Ray Tubes (CRT)









Capacitors / condensers (Containing PCB / PCT)
















Electrolytic Capacitors / Condensers measuring greater than 2.5 cm









in diameter or height









External electrical cables and cords
















Gas Discharge Lamps









Plastics containing Brominated Flame Retardants















Components and parts containing toner and ink, including liquids,



Include the cartridges, print heads, tubes, vent chambers, and service






semi-liquids (gel/paste) and toner









Components and waste containing asbestos
















Components, parts and materials containing refractory ceramic fibers









Components, parts and materials containing radioactive substances
















2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.


Tool Description


Tool Size (if applicable)





screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1.Place the system

2.Disassemble hinge cover & access door

3.Disassemble stand

4.Remove ODD&TOP Perf

5.Disassemble rear cover

6.Disassemble HDD

7.Disassemble CPU&I/O Shielding

8.Disassemble speaker

9.Disassemble stand support

10.Disassemble CPU H/S

11.Disassemble FAN

12.Unplug cable

13.Disassemble WLAN

14.Disassemble INVERTER

15.Disassemble MB

16.Remove power switch card

17.Disassemble webcam & antenna cable

18.Separate BASE pan& bezel

3.2Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).