NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, fan, heat sink, processor, and system board spare part kits. Replacement thermal material is also available in the Thermal Material Kit, spare part number 634433-001.

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with discrete memory.

●Thermal paste is used on the processor (1) and the heat sink section (2) that services it

●A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with UMA memory.

●Thermal paste is used on the processor (1) and the heat sink section (2) that services it

Component replacement procedures 69