The HP BladeSystem
technology brief
Abstract | 3 |
Introduction | 3 |
Components of the enclosure | 3 |
3 | |
Redundant AC power | 4 |
5 | |
Features of the enclosure | 5 |
5 | |
Power zones | 5 |
Firmware in mixed environments | 6 |
Dynamic power saver | 7 |
Redundancy with dynamic power saver | 7 |
Enabling dynamic power saver | 8 |
Serial port | 8 |
Remote access to the serial port | 10 |
Efficient cabling | 10 |
Management link cable | 11 |
Power distribution unit cables | 11 |
Infrastructure configurations | 12 |
Using PDUs with the 1U power enclosure | 13 |
Redundancy | 13 |
Maximum rated VA capacity | 13 |
Number of PDU outlets | 13 |
13 | |
Dynamic power saver and | 13 |
Standard configurations | 15 |
Using ProLiant BL35p server blades | 15 |
Using ProLiant BL30p server blades | 16 |
Using ProLiant BL20p server blades | 17 |
Risks associated with extreme density | 18 |
Supported configurations for the S348 Monitored PDU and S332 Monitored PDU | 18 |
North America/Japan | 18 |