CPU Module and Heat Sink

(HP Authorized Support Providers Only)

Required Equipment:

∙Phillips Screwdriver

Components to remove prior to CPU and Heat Sink:

1.HDD and Battery

2.Icon Assembly and Display Module

3.Palm Rest Assembly

4.Keyboard Assembly and Power Board (PCB Assy DC Power PI-DC)

5.Heat Spreader Assembly

6.Upper Cover and Icon Board (PCB Assy PI-ICON)

Removal Procedure

1.Remove Battery and Hard Disk Drive.

2.Follow the Icon Assembly and Display Module Removal Procedures to remove these components.

3.Follow the Keyboard Assembly and Power Board Removal Procedure to remove these components.

4.Follow the Upper Cover and Icon Board (PCB Assy PI-ICON) Removal Procedures to remove these components. Note, the Icon Board does not need to be removed to gain access to the CPU Module and Heat Sink. However, removing it does create additional space for maneuverability

5.Remove the two screws located towards the back of the CPU Module (see below illustration).

6.A portion of the Heat Sink is located underneath the CPU Module. However, removing the Heat Sink prior to the CPU Module facilitates the removal of the CPU Module. To remove the Heat Sink, unfasten the two screws and lift up on the back of the Heat Sink. This will remove the Heat Sink and dislodge the front socket of the CPU Module.

7.The CPU Module can now be removed completely by gently pulling up and rocking the component back and forth. Be aware of the Contact Spring Docking Pin (see below illustration) as it will easily fall free of the System Board.

Replacement Procedure:

1. Reverse the Removal Procedure with the replacement component(s).

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