HP CQ57-439WM, CQ57-489CA, CQ57-489WM, CQ57-410US manual

Models: CQ57-489CA CQ57-489WM CQ57-410US CQ57-439WM

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.

80 Chapter 4 Removal and replacement procedures

Page 88
Image 88
HP CQ57-439WM, CQ57-489CA, CQ57-489WM, CQ57-410US manual