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Icom IC-GM1600, IC-GM1600E SECTION 8 SEMICONDUCTOR INFORMATION, MP1, NOTE:, MP1(C), MP2 (C), MP4 (C), MP4 (C), MP3 (C), MP1 (CH), MP2 (CH), • DIODES, CHARGE unit, [CHARGE UNIT]

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• BC-158 CHARGER PARTS LISTMECHANICAL PARTS [CHASSIS UNIT]

REF.	ORDER. NO.	DESCRIPTION	QTY.

MP1	8510016540	2810 case	1
MP2	8110007680	2523 cover	1
MP3	8810008660	Screw B0 3 x 8 NI-ZU (BT)	2
MP4	8930047830	Leg cushion (C)	2

[CHARGE UNIT]

REF.	ORDER. NO.	DESCRIPTION	QTY.

MP1	8930057120	2523 Terminal	1
MP2	8930057120	2523 Terminal	1

[ACCESSORIES]

REF.	ORDER. NO.	DESCRIPTION	QTY.

MP1	8810001460	Screw A0 3.5 x 20 SUS	2

MP1

Screw abbreviations A0, B0, BT: Self-tapping NI-ZU: Nickel-zinc SUS: Stainless

MP1(C)CHARGE unitMP1 (CH)MP2 (CH)MP2 (C)MP4 (C)

MP4 (C)

MP3 (C)NOTE: (C) : CHASSIS (CH) : CHARGE UNIT

SECTION 8 SEMICONDUCTOR INFORMATION

• TRANSISTORS AND FET’s

2SA1588 GR		2SB1132 Q		2SC4116 BL		2SC4116 GR		2SC4213 B
(Symbol: ZG)		(Symbol: BAQ)		(Symbol: LL)		(Symbol: LG)		(Symbol: AB)
B		B		B		B		B
B				B		B		B
	C	C			C		C		C
E		E		E		E		E
		E
2SC4215 O		2SC4215 Y		2SC4226 R25		2SC5107 O		2SC5110 O
(Symbol: QO)		(Symbol: QY)		(Symbol: R25)		(Symbol: MFO)		(Symbol: MGO)
B		B		B		B		B
	C		C		C		C		C
E		E		E		E		E
2SK880 Y		2SK1829		3SK294		3SK299 U73		DTA144 TU
(Symbol: XY)		(Symbol: K1)		(Symbol: UV)		(Symbol: U73)		(Symbol: 06)
S		E	B	G1	S			B
S				G1	S
	G								C
D		C	E	G2	D			E
		C	E					E
RD01MUS1		RD07MVS1		RSR025N03		UMD6		UNR9111J
(Symbol: K2)		(Symbol: RD07MVS1)		(Symbol: QY)		(Symbol: D6)		(Symbol: 6A)
G				G		E1	C1	B
				G				B
S	S	G	D		D	B1	B2		C
D				S		C2	E2	E
				S
		S
		S
UNR9113J		UNR9213J		XP1213		XP4313		XP4601
(Symbol: 6C)		(Symbol: 8C)		(Symbol: 9L)		(Symbol: 8S)		(Symbol: 5C)
B		B		B1	C1	E1	C1	E1	C1
B		B		B1	C1			E1	C1
	C		C	E1		B1	B2	B1	B2
E		E		B2	C2	C2	E2	C2	E2
				B2	C2			C2	E2

XP1214		XP6501 AB
(Symbol: 9H)		(Symbol: 5N)
B1	C1	E1	C1
E1		E2	B1
B2	C2	B2	C2

• CIRCUIT DIAGRAM

1
HEC2305-01-250	R1	120
H		CC	MP1
GN			MP1
GN
GN
	R2	150
R3 1 k		S1 SEL2410G

GNMP2

• DIODES

1SS375

1SV245

1SV307

1SV308

DA221

(Symbol: FH)

(Symbol: T3)

(Symbol: TX)

(Symbol: TX)

(Symbol: K)

A1

A1

C

C

A2

A2

DAN222

HVC350B

MA2S077

MA2S111

MA2S728

(Symbol: N)

(Symbol: B0)

(Symbol: S)

(Symbol: A)

(Symbol: B)

A1

A2

C

MA77

RB706F-40

SB20-03P

(Symbol: 4B)

(Symbol: 3J)

(Symbol: SC)

C

A

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Contents

Page INTRODUCTION DANGER ORDERING PARTS REPAIR NOTES TABLE OF CONTENTS SECTION SPECIFICATIONS •CHANNEL LISTS •International channels †Receive only USA channels †Low power only SECTION 2 INSIDE VIEWS SECTION 3 DISASSEMBLY INSTRUCTIONS SECTION 4 CIRCUIT DESCRIPTION 4-1RECEIVER CIRCUITS 4-2TRANSMITTER CIRCUITS 4-3PLL CIRCUITS 4-4POWER SUPPLY CIRCUITS 4-5PORT ALLOCATIONS SECTION 5 ADJUSTMENT PROCEDURES 5-1PREPARATION •CONNECTION to the antenna connector Standard signal generator 0.1 µV to 32 mV (–127dBm to –17dBm) DO NOT transmit while an SSG is connected to the antenna connector 20 dB / 30 dB NOTE: The above screen is an example Each transceiver has its own specific values for each setting 5-2SOFTWARE ADJUSTMENT (FREQUENCY) Each transceiver has its own specific values 5-2SOFTWARE ADJUSTMENT (TRANSMITTING) 5-2SOFTWARE ADJUSTMENT (RECEIVING) SECTION 6 PARTS LIST Page Page Page [VR UNIT] [MIC UNIT] [CHASSIS UNIT] •BC-158 [CHARGE UNIT] SECTION 7 MECHANICAL PARTS AND DISASSEMBLY CABINET PARTS Grease NOTE Manufacture : Shin-EtsuChemical Type : G-501 NOTE 2: When replacing the screws, 10 - 12 kg of torque SECTION 8 SEMICONDUCTOR INFORMATION SECTION 9 BOARD LAYOUTS 9-1MAIN UNIT Horizontal Vertical (CHASSIS unit) •BOTTOM VIEW 6 GND VOLO VOLIN 1 VCC 9-2VR BOARD 9-3MIC BOARD 9-4 BC-158 Horizonal to the MAIN unit J414 SECTION 10 BLOCK DIAGRAM SECTION 11 VOLTAGE DIAGRAM 11-1MAIN UNIT