Intel BXF80646I74770K 3.0 Independent Loading Mechanism (ILM)

3.0 Independent Loading Mechanism (ILM)

The ILM has two critical functions – deliver the force to seat the processor onto the

socket contacts and distribute the resulting compressive load evenly through the

socket solder joints.

The mechanical design of the ILM is integral to the overall functionality of the

LGA1150 socket. Intel performs detailed studies on integration of processor package,

socket and ILM as a system. These studies directly impact the design of the ILM. The

Intel reference ILM will be “build to print” from Intel controlled drawings. Intel

recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not

benefit from Intel's detailed studies and may not incorporate critical design

parameters.

Note: There is a single ILM design for the LGA1150 socket, LGA1156 socket, and LGA1155

socket.

The ILM consists of two assemblies that will be procured as a set from the enabled

vendors. These two components are ILM assembly and back plate. To secure the two

assemblies, two types of fasteners are required – a pair (2) of standard 6-32 thread

screws and a custom 6-32 thread shoulder screw. The reference design incorporates a

T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users

do not inadvertently remove the ILM assembly and for consistency with the LGA1366

socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once

assembled the ILM is not required to be removed to install / remove the motherboard

from a chassis.

ILM Assembly Design Overview

The ILM assembly consists of 4 major pieces – ILM cover, load lever, load plate, and

the hinge frame assembly.

All of the pieces in the ILM assembly except the hinge frame and the screws used to

attach the back plate are fabricated from stainless steel. The hinge frame is plated.

The frame provides the hinge locations for the load lever and load plate. An insulator

is pre-applied to the bottom surface of the hinge frame.

Figure 14 on page 30 through Figure 17 on page 33 list the applicable keep-out

zones of the socket and ILM. Figure 14 on page 30 describes recommended

maximum heights of neighboring components on the primary side of the board to

avoid interference with the Intel® reference thermal solution. The keep-out zone in

Figure 14 on page 30 does not prevent incidental contact with the ILM load plate

and ILM cover while it is open for insertion/removal of the processor. In designs

requiring no cosmetic marks to be made on capacitors along the hinge side of the ILM,

the recommendation is for the location of the capacitors to be against the keep-out

zone boundary closest to the hinge of the ILM. This location does not prevent contact

between the ILM and the capacitors; however it minimizes the load applied by the ILM

to the capacitors.

LGA1150 Socket—Independent Loading Mechanism (ILM)

LGA1150 Socket

Application Guide September 2013

16 Order No.: 328999-002