Table 5 on page 25 provides load specifications for the LGA1150 socket with the ILM

installed. The maximum limits should not be exceeded during heatsink assembly,

shipping conditions, or standard use condition. Exceeding these limits during test may

result in component failure. The socket body should not be used as a mechanical

reference or load-bearing surface for thermal solutions.

Table 5. Socket and ILM Mechanical Specifications

Parameter Minimum Maximum Notes
ILM static compressive load on processor
IHS 311 N [70 lbf] 600 N [135 lbf] 3, 4, 7, 8
Heatsink static compressive load 0 N [0 lbf] 222 N [50 lbf] 1, 2, 3
Total static compressive Load (ILM plus
Heatsink) 311 N [70 lbf] 822 N [185 lbf] 3, 4, 7, 8
Dynamic Compressive Load (with heatsink
installed) N/A 712 N [160 lbf] 1, 3, 5, 6
Pick & Place cover insertion force N/A 10.2 N [2.3 lbf] –
Pick & Place cover removal force 2.2N [0.5 lbf] 7.56 N [1.7 lbf] 9
Load lever actuation force
N/A
20.9N [4.7lbf] in the vertical
direction 10.2 N [2.3 lbf] in
the lateral direction.
–
Maximum heatsink mass N/A 500g 10
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and its retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3. Loading limits are for the LGA1150 socket.
4. This minimum limit defines the static compressive force required to electrically seat the processor onto
the socket contacts. The minimum load is a beginning of life load.
5. Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load
superimposed on the static load requirement.
6. Test condition used a heatsink mass of 500 gm [1.102 lb.] with 50 g acceleration (table input) and an
assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product
application can have flexibility in specific values. The ultimate product of mass times acceleration plus
static heatsink load should not exceed this limit.
7. The maximum BOL value and must not be exceeded at any point in the product life.
8. The minimum value is a beginning of life loading requirement based on load degradation over time.
9. The maximum removal force is the flick up removal upwards thumb force (measured at 45°), not
applicable to SMT operation for system assembly. Only the minimum removal force is applicable to
vertical removal in SMT operation for system assembly.
10.The maximum heatsink mass includes the core, extrusion, fan and fasteners. This mass limit is evaluated
using the POR heatsink attach to the PCB.
Electrical Requirements

LGA1150 socket electrical requirements are measured from the socket-seating plane

of the processor to the component side of the socket PCB to which it is attached. All

specifications are maximum values (unless otherwise stated) for a single socket

contact, but includes effects of adjacent contacts where indicated.

4.2
LGA1150 Socket and ILM Specifications—LGA1150 Socket
LGA1150 Socket
September 2013 Application Guide
Order No.: 328999-002 25