Appendix C Heatsink Back Plate Drawings
This heatsink back plate design is intended to adapt as a reference for OEMs that use
threaded fasteners on customized thermal solution, to comply with the mechanical
and structural requirements for the LGA115x socket. The heatsink back plate does not
have to provide additional load for socket solder joint protect. Structural design
strategy for the heatsink is to provide sufficient load for the Thermal Interface Material
(TIM) and to minimize stiffness impact on the motherboard.
Note: Design modifications for specific application and manufacturing are the responsibility
of OEM and the listed vendors for customized system implementation and validation.
These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, reliability, functionality, or compatibility of these devices. Customers
are responsible for thermal, mechanical, and environmental validation of these
solutions. This list and/or these devices may be subject to change without notice.
Please refer to the motherboard keep-out zone listed in the LGA1150 Socket
Application Guide to ensure compliant with the heatsink back plate implementation.
Figure 18 on page 35 is the heatsink back plate keep-in zone for the design
implementation.
Table 10 on page 34 lists the mechanical drawings included in this appendix. Table
11 on page 34 lists the mechanical drawings
Table 10. Mechanical Drawing List
Drawing Description Figure Number/Location
Heatsink Back Plate Keep-in Zone Figure 18 on page 35
Heatsink Back Plate Figure 19 on page 36
Table 11. Supplier Contact Information
Supplier Contact Phone Email
CCI (Chaun Choung Technology
Corp.)
Monica Chih +886-2-29952666
x1131
monica_chih@ccic.com.tw
The enabled components may not be currently available from supplier. Contact the
supplier directly to verify time of component availability.
LGA1150 Socket—Heatsink Back Plate Drawings
LGA1150 Socket
Application Guide September 2013
34 Order No.: 328999-002