Intel BXF80646I74770K

Figure 18. Heatsink Back Plate Keep-in Zone

Heatsink Back Plate Drawings—LGA1150 Socket

LGA1150 Socket

September 2013 Application Guide

Order No.: 328999-002 35

Contents

Main LGA1150 Socket Application Guide September 2013 2 Order No.: 328999-002 Contents Figures Tables Page 1.0 Introduction 1.2 Related Documents Definition of Terms Table 2. Terms and Descriptions Page 2.0 LGA1150 Socket 2.1 Board Layout Page Socket Components 2.3 Page Package Installation / Removal 2.4 Durability Markings 2.5 2.6 Page 3.0 Independent Loading Mechanism (ILM) Design Concept 3.1 Page Page Page Page Independent Loading Mechanism (ILM) Interchangeability Markings 3.5 Independent Loading Mechanism (ILM) Cover 3.3 Page Page 4.0 LGA1150 Socket and ILM Specifications Mechanical Specifications 4.1 Electrical Requirements 4.2 Table 6. Electrical Requirements for LGA1150 Socket Environmental Requirements 4.3 Page Appendix A Component Suppliers Table 8. Supplier Contact Information Appendix B Mechanical Drawings Page Page Page Page Appendix C Heatsink Back Plate Drawings