Intel BXF80646I74770K 4.0 LGA1150 Socket and ILM Specifications

4.0 LGA1150 Socket and ILM Specifications

This chapter describes the following specifications and requirements:

•Mechanical Specifications on page 24

•Electrical Requirements on page 25

•Environmental Requirements on page 26

Component Mass

Table 3. Socket Component Mass

Component Mass

Socket Body, Contacts and PnP Cover 10 g

ILM Cover 29 g

ILM Back Plate 38 g

Package / Socket Stackup Height

The following table provides the stackup height of a processor in the 1150-land LGA

package and LGA1150 socket with the ILM closed and the processor fully seated in the

socket.

Table 4. 1150-land Package and LGA1150 Socket Stackup Height

Component Stackup Height Note

Integrated Stackup Height (mm) From Top of Board to Top of IHS 7.781 ± 0.335 mm 2

Socket Nominal Seating Plane Height 3.4 ± 0.2 mm 1

Package Nominal Thickness (lands to top of IHS) 4.381 ± 0.269 mm 1

Note:

1. This data is provided for information only, and should be derived from: (a) the height of the socket

seating plane above the motherboard after reflow, given in Socket Mechanical Drawings, (b) the height of

the package, from the package seating plane to the top of the IHS, and accounting for its nominal

variation and tolerances that are given in the corresponding processor datasheet.

2. The integrated stackup height value is a RSS calculation based on current and planned processors that

will use the ILM design.

Loading Specifications

The socket will be tested against the conditions listed in Thermal Solution Quality and

Reliability Requirements Chapter of the Processor Thermal Mechanical Design

Guidelines (see Related Documents section) with heatsink and the ILM attached,

under the loading conditions outlined in this section.

LGA1150 Socket—LGA1150 Socket and ILM Specifications

LGA1150 Socket

Application Guide September 2013

24 Order No.: 328999-002