1.0 Introduction

This document covers the LGA1150 socket for Desktop systems using the Desktop 4th

Generation Intel® Core™ processor family, Desktop Intel® Pentium® processor family,

and for UP Server / Workstation systems using the Intel® Xeon® processor E3-1200

v3 product family.

The information in this document include:

• The thermal and mechanical specifications for the socket

• The mechanical interface requirements to properly integrate the socket into a

board design

Related Documents

Material and concepts available in the following documents may be beneficial when

reading this document.

Table 1. Related Documents

Title Document Number /
Location
Desktop 4th Generation Intel® Core™ Processor Family and Desktop Intel®
Pentium® Processor Family Datasheet - Volume 1 of 2
328897
Desktop 4th Generation Intel® Core™ Processor Family and Desktop Intel®
Pentium® Processor Family Datasheet - Volume 2 of 2
328898
Intel® Xeon® Processor E3-1200 v3 Product Family Datasheet - Volume 1 of 2 328907
Intel® Xeon® Processor E3-1200 v3 Product Family Datasheet - Volume 2 of 2 329000
Desktop 4th Generation Intel® Core™ Processor Family and Intel® Xeon®
Processor E3-1200 v3 Product Family Thermal Mechanical Design Guidelines
328900
Intel® 8 Series / C220 Series Chipset Family Platform Controller Hub (PCH)
Thermal Mechanical Specifications and Design Guidelines
328906

Definition of Terms

Table 2. Terms and Descriptions

Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct.
For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal
event.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation
temperature.
continued...

1.1

1.2

Introduction—LGA1150 Socket
LGA1150 Socket
September 2013 Application Guide
Order No.: 328999-002 7