IntelP®P Server Board S3420GP TPS Disclaimers
Disclaimers Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
This document contains information for a product that is still in development. Do not
finalize a design with this information. Information provided in this preliminary document may be
incomplete (as denoted by TBD) or may change. Revised information will be published in a later
release of this document and when the product is made available. Verify with your local sales
office that you have the latest datasheet before finalizing a design.
The Intel® Server Board S3420GP may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata
are available on request.
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel’s own chassis are designed and tested to
meet the intended thermal requirements of these components when the fully integrated system
is used together. It is the responsibility of the system integrator that chooses not to use Intel
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or non-operating
limits.
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*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2009.
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