Intel SR6850HW4 2.6New Platform Features, 2.5.12Cooling Subsystem, 2.6.1Advanced Memory Performance and Protection

System Overview Intel® Server Platform SR6850HW4 TPS

2.5.12Cooling Subsystem

Primary cooling is generated by six fans, located at the top front of the chassis. It connects to the SCSI Backplane Board for power and server management. Air flows in through the front and exhausts out the rear of the chassis. The chassis has several air baffles to duct the air over critical parts, including processors, memory, and peripherals. Processor heat sinks or processor heat sink blanks, and Memory Boards or Memory Board blanks must be installed in each corresponding area to ensure proper airflow.

The system fans are sized to provide cooling for a fully configured system. The cooling system is designed using a worst-case analysis and appropriate fan speeds were chosen to meet acoustic and thermal requirements. Server management controls fan speed based on ambient and component temperatures. To ensure proper cooling, failed fans should be replaced within 1 minute.

2.6New Platform Features

2.6.1Advanced Memory Performance and Protection

The Server Board Set SE8500HW4 supports several new memory features that allow flexibility in performance, redundancy and the ability to upgrade. The System BIOS can be configured as follows:

ƒMaximum performance, where memory is up to four-way interleaved

ƒMaximum compatibility, where memory can be hot-added

ƒMemory mirroring, where two or four boards are used to keep a copy of system memory

ƒMemory RAID, where four boards are used in a RAID4-like mode

ƒMemory sparing, where a portion of each Memory Board is reserved for failover.

Hot-replace means the user can replace a Memory Board with another Memory Board of identical total size. This operation is supported in maximum compatibility, memory RAID and memory mirroring modes.

Hot-add means the user can add a Memory Board to a previously unoccupied slot. This requires operating system support and is supported in memory compatibility and memory mirroring modes.

Hot-removal means the user can remove a Memory Board. This operation is supported in memory RAID and memory mirroring modes.

Hot upgrade means the user can replace an existing Memory Board with a Memory Board that contains more memory capacity. A hot upgrade is not a unique operation, it is implemented as a hot-remove followed by a hot-add. This requires operating system support and is supported by the memory RAID mode only.

See the Intel Server Board Set SE8500HW4 Technical Product Specification for more details on these new features.

16	Revision 1.0
	Intel order number D23151-001