Intel SR6850HW4 Table of Contents

Intel® Server Platform SR6850HW4 TPSTable of Contents

Table of Contents

1.	Product Overview.................................................................................................................		1
2.	System Overview..................................................................................................................		3
	2.1	System Feature Overview........................................................................................	3
	2.2	Introduction ..............................................................................................................	4
	2.3	External Chassis Features - Front ...........................................................................	8
	2.3.1	Front Control Panel..................................................................................................	8
	2.3.2	Hot-swap Hard Disk Drive and Peripheral Device Bays ..........................................	9
	2.4	External Chassis Features - Rear..........................................................................	10
	2.5	Internal Chassis Features......................................................................................	11
	2.5.1	Server Board Set SE8500HW4 Mainboard............................................................	11
	2.5.2	Server Board Set SE8500HW4 Memory Board .....................................................	12
	2.5.3	Power Distribution Board .......................................................................................	12
	2.5.4	SCSI Backplane Board Board ...............................................................................	12
	2.5.5	Front Panel I/O Board............................................................................................	13
	2.5.6	Front Panel Control Board .....................................................................................	13
	2.5.7	SATA-to-IDE Converter Board...............................................................................	13
	2.5.8	Intel® Management Module...................................................................................	13
	2.5.9	Fibre Channel Module ...........................................................................................	14
	2.5.10	RAID On Motherboard (ROMB) .............................................................................	14
	2.5.11	Power Supply Module............................................................................................	14
	2.5.12	Cooling Subsystem................................................................................................	16
	2.6	New Platform Features ..........................................................................................	16
	2.6.1	Advanced Memory Performance and Protection ...................................................	16
	2.6.2	Rolling BIOS ..........................................................................................................	17
	2.7	Server Management ..............................................................................................	17
	2.7.1	Intel Management Module (IMM)...........................................................................	17
	2.7.2	Hot Swap Controller...............................................................................................	19
	2.8	Reliability, Availability, Serviceability, Usability, Manageability (RASUM) .............	19
	2.9	Expansion Support ................................................................................................	20
	2.10	Specifications.........................................................................................................	21
	2.10.1	Environmental Specifications Summary ................................................................	21
	2.10.2	Physical Specifications ..........................................................................................	22
Revision 1.0		Intel order number D23151-001		iii