Intel® Server Platform SR6850HW4 TPSTable of Contents
Table of Contents1. | Product Overview................................................................................................................. | 1 |
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2. | System Overview.................................................................................................................. | 3 |
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| 2.1 | System Feature Overview........................................................................................ | 3 | ||
| 2.2 | Introduction .............................................................................................................. | 4 | ||
| 2.3 | External Chassis Features - Front ........................................................................... | 8 | ||
| 2.3.1 | Front Control Panel.................................................................................................. | 8 | ||
| 2.3.2 | 9 |
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| 2.4 | External Chassis Features - Rear.......................................................................... | 10 |
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| 2.5 | Internal Chassis Features...................................................................................... | 11 | ||
| 2.5.1 | Server Board Set SE8500HW4 Mainboard............................................................ | 11 |
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| 2.5.2 | Server Board Set SE8500HW4 Memory Board ..................................................... | 12 |
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| 2.5.3 | Power Distribution Board ....................................................................................... | 12 | ||
| 2.5.4 | SCSI Backplane Board Board ............................................................................... | 12 | ||
| 2.5.5 | Front Panel I/O Board............................................................................................ | 13 | ||
| 2.5.6 | Front Panel Control Board ..................................................................................... | 13 | ||
| 2.5.7 | 13 | |||
| 2.5.8 | Intel® Management Module................................................................................... | 13 | ||
| 2.5.9 | Fibre Channel Module ........................................................................................... | 14 | ||
| 2.5.10 | RAID On Motherboard (ROMB) ............................................................................. | 14 | ||
| 2.5.11 | Power Supply Module............................................................................................ | 14 | ||
| 2.5.12 | Cooling Subsystem................................................................................................ | 16 | ||
| 2.6 | New Platform Features .......................................................................................... | 16 | ||
| 2.6.1 | Advanced Memory Performance and Protection ................................................... | 16 |
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| 2.6.2 | Rolling BIOS .......................................................................................................... | 17 | ||
| 2.7 | Server Management .............................................................................................. | 17 | ||
| 2.7.1 | Intel Management Module (IMM)........................................................................... | 17 | ||
| 2.7.2 | Hot Swap Controller............................................................................................... | 19 | ||
| 2.8 | Reliability, Availability, Serviceability, Usability, Manageability (RASUM) ............. | 19 |
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| 2.9 | Expansion Support ................................................................................................ | 20 | ||
| 2.10 | Specifications......................................................................................................... | 21 | ||
| 2.10.1 | Environmental Specifications Summary ................................................................ | 21 | ||
| 2.10.2 | Physical Specifications .......................................................................................... | 22 | ||
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Revision 1.0 | Intel order number |
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