System Overview

Intel® Server Platform SR6850HW4 TPS

2.5.2Server Board Set SE8500HW4 Memory Board

Each Memory Board supports the following features:

ƒPCI Express x16 card edge connector that plugs into the Server Board Set SE8500HW4 Mainboard

ƒIntel E8500 chipset eXtended Memory Bridge (XMB)

ƒFour DDR2 400HMz DIMM slots for registered ECC memory

ƒSupport for both single-rank and dual-rank DIMMs

ƒTwo DDR2 400MT/s busses

ƒIndependent Memory Interface (IMI), a high-speed differential bus

ƒLED error indicators for each DIMM and an attention LED for hot-plug events

ƒLED indicator for both memory mirroring and RAID configurations

ƒMemory hot-plug at the card level, based on the PCI hot-plug model

ƒField Replaceable Unit (FRU) device

ƒTwo temperature sensors

ƒSafety mechanism for instant power shut-down to the Memory Board when not properly removed or inserted

See the Intel Server Board Set SE8500HW4 Technical Product Specification for descriptions of this board.

2.5.3Power Distribution Board

The Power Distribution Board is located horizontally, below the Server Board Set SE8500HW4 Mainboard in the middle-rear of the chassis. It has two connectors for the hot- swap power supply modules and provides 12V, standby power and server management signals to the Server Board Set SE8500HW4 Mainboard and SCSI Backplane Board. The power distribution circuitry reports quantity, quality, and location of the installed power supplies through I2C server management. See Chapter 6 for a description of this board.

2.5.4SCSI Backplane Board Board

The SCSI Backplane Board mounts vertically in the front of the system and contains ten industry-standard hot-swap Single Connector Attach 2 (SCA-2) connectors (80-pin). Ultra320 (or slower) Low Voltage Differential (LVD) SCSI hard disk drives can be installed in the system. The backplane accepts 15,000-RPM (and slower) hard disk drives. Single- Ended (SE) SCSI devices are not supported in the hot-swap hard disk drive bay.

12

Revision 1.0

 

Intel order number D23151-001