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| 16.1. Outline | 38 | 23 | ACCESSORIES AND PACKING MATERIALS | 52 | |
| 16.2. Power Supply Circuit | 39 | 24 | REPLACEMENT PARTS LIST | 53 | |
| 16.3. Reset Circuit (Base Unit) | 40 |
| 24.1. Base Unit | 53 | |
| 16.4. Charge Circuit | 41 |
| 24.2. Handset | 56 | |
| 16.5. Telephone Line Interface | 41 |
| 24.3. ACCESSORIES AND PACKING MATERIALS | 58 | |
| 16.6. Transmitter/Receiver | 42 | 25 | FOR SCHEMATIC DIAGRAM | 59 | |
| 16.7. Signal Route | 44 |
| 25.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) | 59 | |
17 CIRCUIT OPERATION (HANDSET) | 45 |
| 25.2. Handset (SCHEMATIC DIAGRAM (Handset)) | 59 | ||
| 17.1. Reset Circuit (Handset) | 45 | 26 | SCHEMATIC DIAGRAM (Base Unit) | 60 | |
| 17.2. Battery Low / Power Down Detector | 46 |
| 26.1. Base Unit | 60 | |
18 | CPU DATA (Base Unit) | 47 |
| 26.2. RF Unit (Base Unit) | 61 | |
| 18.1. IC2 | 47 | 27 | SCHEMATIC DIAGRAM (Handset) | 62 | |
19 | CPU DATA (Handset) | 48 |
| 27.1. Handset | 62 | |
| 19.1. IC2 | 48 |
| 27.2. RF Unit (Handset) | 63 | |
20 | HOW TO REPLACE FLAT PACKAGE IC | 49 | 28 | CIRCUIT BOARD (Base Unit) | 65 | |
| 20.1. Preparation | 49 |
| 28.1. Component View | 65 | |
| 20.2. Procedure | 49 |
| 28.2. Flow Solder Side View | 66 | |
| 20.3. Modification Procedure of Bridge | 49 | 29 | CIRCUIT BOARD (Handset) | 67 | |
21 | CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT) |
| 29.1. Component View | 67 | ||
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| 29.2. Flow Solder Side View | 68 | |
22 | CABINET AND ELECTRICAL PARTS LOCATION (HANDET) | 51 |
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