2000 Nov 15 7
Philips Semiconductors Preliminary specification
UHF amplifier module BGY280
Z1Z4
Z3
Z2
VC
VC
VS
VS
RF input RF output
RF outputRF input
GSM1800
BGY280
GSM900
12
13
15
16
8
7
5
4
Fig.11 Test circuit
List of components (See Fig 10 and 11)
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr=2.2);
thickness 1⁄32 inch.
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
C1, C4multilayer ceramic chip capacitor 100 µF; 40 V
C2, C3electrolytic capacitor 100 nF
Z1, Z2, Z3, Z4stripline; note 1 50 Ωwidth 2.33 mm
R1, R2metal film resistor 100 Ω; 0.6 W 2322 156 11001