2000 Oct 16 8
Philips Semiconductors Product specification
GSM/DCS/PCS power amplifier CGY2014TT
APPLICATION INFORMATION
handbook, full pagewidth
FCA174
1
2
3
4
5
6
7
8
9
10 11
12
20
19
18
17
16
15
14
13
CGY2014TT
TRL2
TRL1
n.c.
TRL3
10 nF
3.9 nH
3.3 nH
100 pF
1
pF
Vd23DCS
Vd1DCS
Vd1GSM
RFinGSM RFILB
RFinDCS
100 pF
1 nF
4.7
pF
6 pF
4 pF
TRL6
TRL4 TRL5
BA891
56 pF
4.7 pF 9.1 pF
100 pF
3 pF
2.7 pF
5.6 pF
3.3 kΩ
1 nF
n.c. n.c.
n.c.
n.c.
n.c.
n.c.(1)
GND
RFIHB
VDD1HB
VDD2HB
VDD2HB
VDD2LB
VDD1LB
RFO/VDD3HB
RFoutDCS
RFoutGSM
Vpin
RFO/VDD3HB
RFO/VDD3LB
RFO/VDD3LB
GND1LB
Vd23GSM
Fig.7 Application diagram.
(1) Pin 16 is internally connected to ground and should not be connected to the board.
(2) Transmission lines:
Thickness 0.4 mm, substrate FR4 and εr= 4.7.
TRL1: width = 500 µm, length = 4.5 mm.
TRL2: width = 500 µm, length = 20 mm.
TRL3: width = 150 µm, length = 30 mm.
TRL4: width = 500 µm, length = 4 mm.
TRL5: width = 500 µm, length = 1.5 mm.
TRL6: width = 500 µm, length = 13 mm.