Philips TDA8001

1996 Dec 12 13

Philips Semiconductors Product speciﬁcation

Smart card interface TDA8001

Fig.10 Power derating curve (DIP28).

handbook, halfpage

MBE256

50 0 50 100 150

Ptot

(W)

T ( C)

amb o

Fig.11 Power derating curve (SO28).

handbook, halfpage

MBE255

50 100 150

Ptot

(W)

T ( C)

amb

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.

Method 3015 (HBM 1500 Ω, 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

Rthj-a thermal resistance from junction to ambient in free air

SOT117-1 30 K/W

SOT136-1 70 K/W

Contents

Main Page Page 1996 Dec 12 4 BLOCK DIAGRAM TDA8001 Fig.1 Block diagram. Page 1996 Dec 12 6 Fig.2 Pin configuration. TDA8001 TDA8001T Fig.3 Pin configuration. TDA8001A TDA8001AT Page Smart card interface TDA8001 1996 Dec 12 9 Fig.5 Clock circuitry. 1996 Dec 12 10 Fig.6 State diagram. Fig.7 Activation sequence. 1996 Dec 12 11 Fig.8 Deactivation sequence. Fig.9 Deactivation after a card extraction during write mode. Page Page Page Page Page Page 1996 Dec 12 18 INTERNAL PIN CONFIGURATION Fig.13 Internal pin configuration. TDA8001 1996 Dec 12 19 APPLICATION INFORMATION Fig.14 Application in a pay TV decoder. 1996 Dec 12 20 PACKAGE OUTLINES DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1 1996 Dec 12 21 SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 IC Package Databook Page Philips Semiconductors a worldwide company Printed in The Netherlands