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Philips TDA8001 1996 Dec 12 6, Fig.2 Pin configuration., Fig.3 Pin configuration.

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1996 Dec 12 6

Philips Semiconductors Product speciﬁcation

Smart card interface TDA8001

Fig.2 Pin configuration.

handbook, halfpage

TDA8001

TDA8001T

MBH811

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

XTAL

DETECT

I/O

RST

CLK

VPP12.5

VPP15

PRES

PRES

VPP

VDD

VCC

VH

GND1

I/O(µC)

CMD7 or CDMS

RSTIN

GND2

CLKOUT2

CMD3.5 or CDMTC

CVNC

VPP21

CMDVCC

OFF

ALARM

ALARM

DELAY

VSUP

Fig.3 Pin configuration.

handbook, halfpage

TDA8001A

TDA8001AT

MBH812

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

XTAL

DETECT

I/O

RST

CLK

n.c.

n.c.

PRES

PRES

n.c.

VDD

VCC

VH

GND1

I/O(µC)

CMD7 or CDMS

RSTIN

GND2

CLKOUT2

CMD3.5 or CDMTC

CVNC

n.c.

CMDVCC

OFF

ALARM

ALARM

DELAY

VSUP

Contents

Main Page Page 1996 Dec 12 4 BLOCK DIAGRAM TDA8001 Fig.1 Block diagram. Page 1996 Dec 12 6 Fig.2 Pin configuration. TDA8001 TDA8001T Fig.3 Pin configuration. TDA8001A TDA8001AT Page Smart card interface TDA8001 1996 Dec 12 9 Fig.5 Clock circuitry. 1996 Dec 12 10 Fig.6 State diagram. Fig.7 Activation sequence. 1996 Dec 12 11 Fig.8 Deactivation sequence. Fig.9 Deactivation after a card extraction during write mode. Page Page Page Page Page Page 1996 Dec 12 18 INTERNAL PIN CONFIGURATION Fig.13 Internal pin configuration. TDA8001 1996 Dec 12 19 APPLICATION INFORMATION Fig.14 Application in a pay TV decoder. 1996 Dec 12 20 PACKAGE OUTLINES DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1 1996 Dec 12 21 SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 IC Package Databook Page Philips Semiconductors a worldwide company Printed in The Netherlands