1996 Dec 12 16
Philips Semiconductors Product specification
Smart card interface TDA8001
Card supply voltage (VCC)
VCC output voltage idle mode; active mode −−0.4 V
ICC < 100 mA 4.75 5.25 V
IPP/t < 100 mA/100 ns;
note 4 4.75 5.25 V
ICC output current VCC from 0 to 5 V −−100 mA
VCC shorted to GND −−200 mA
SR slew rate up or down 0.3 0.4 0.5 V/µs
5 V reference output voltage (CVNC)
VCVNC output voltage at pin CVNC 4.5 5.0 5.5 V
ICVNC output current at pin CVNC −−50 mA
Crystal connection (XTAL)
Rxtal(neg) negative resistance at pin XTAL 2 MHz < fi< 16 MHz;
note 5
−−300
Vxtal DC voltage at pin XTAL 3.0 4.0 V
fxtal resonant frequency 4 16 MHz
external frequency 0 20 MHz
Clock output (CLKOUT2)
fCLKOUT2 frequency on CLKOUT2 1 8 MHz
VOL LOW level output voltage IOL=2mA −−0.4 V
VOH HIGH level output voltage IOH =−200 µA 3.0 −− V
I
OH =−10 µA 4.0 −− V
t
r
, tfrise and fall times CL=15pF; note 2 −���25 ns
δduty factor CL=15pF; note 2 40 60 %
Data line [I/O, I/O(µC)]
VOH HIGH level output voltage on
pin I/O 4.5V<V
SUP < 5.5 V;
4.5V<V
I/O(µC) < 5.5 V;
IOH =−20 µA
4.0 VCC+ 0.1 V
4.5V<V
SUP < 5.5 V;
4.5V<V
I/O(µC) < 5.5 V;
IOH =200 µA
2.4 −− V
V
OL LOW level output voltage on
pin I/O II/O= 1 mA;
I/O(µC) grounded
−−100 mV
IIL LOW level input current on
pin I/O(µC) I/O(µC) grounded −−500 µA
VOH HIGH level output voltage on
pin I/O(µC) 4.5V<V
I/O < 5.5 V 4.0 VSUP + 0.2 V
VOL LOW level output voltage on
pin I/O(µC) II/O(µC) = 1 mA;
I/O grounded
−−70 mV
IIL LOW level input current on pin I/O I/O grounded −−500 µA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT