1996 Dec 12 20
Philips Semiconductors Product speciļ¬cation
Smart card interface TDA8001
PACKAGE OUTLINES
UNIT A
max. 1 2 b1
(1)
(1) (1)
cD E weM
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT117-1 92-11-17
95-01-14
A
min. A
max. bZ
max.
ME
e1
1.7
1.3 0.53
0.38 0.32
0.23 36.0
35.0 14.1
13.7 3.9
3.4 0.252.54 15.24 15.80
15.24 17.15
15.90 1.75.1 0.51 4.0
0.066
0.051 0.020
0.014 0.013
0.009 1.41
1.34 0.56
0.54 0.15
0.13 0.010.10 0.60 0.62
0.60 0.68
0.63 0.0670.20 0.020 0.16
051G05 MO-015AH
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
28
1
15
14
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1