1999 Oct 12 16
Philips Semiconductors Product specification
IC card interface TDA8002C
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1 500 Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDDD digital supply voltage −0.3 +6.5 V
VDDA analog supply voltage −0.3 +6.5 V
VCC card supply voltage pins;
XTAL1,XTAL2, ALARM, CS, MODE,
RSTIN, CLKSEL, AUX2UC,AUX1UC,
CLKDIV1, CLKDIV2, CLKOUT,
STROBE, CMDVCC, CV/TV and OFF
−0.3 +6.5 V
Vi(card) input voltage on card contact pins;
I/O, AUX2,PRES, PRES, AUX1, CLK,
RST and VCC
−0.3 +6.5 V
Ves electrostatic handling voltage
on pins I/O, AUX2, PRES, PRES,
AUX1, CLK, RST and VCC
−6+6kV
on all other pins −2+2kV
T
stg storage temperature −55 +125 °C
Ptot continuous total power dissipation
TDA8002CT/x Tamb =−25 to +85 °C−0.56 W
TDA8002CG Tamb =−25 to +85 °C−0.46 W
Tamb ambient temperature −25 +85 °C
Tjjunction temperature −150 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air
SOT136-1 70 K/W
SOT401-1 91 K/W