Philips TDA8002C

1999 Oct 12 21

Philips Semiconductors Product speciﬁcation

IC card interface TDA8002C

Notes

1. It may be necessary to connect capacitors from XTAL1 and XTAL2 to ground depending on the choice of crystal or

resonator.

2. When the oscillator is stopped in mode 1, XTAL1 is set to HIGH.

3. The transition time and duty cycle definitions are shown in Fig.15;

4. CLKOUT transition time and duty cycle do not need to be tested.

5. PRES and CMDVCC are active LOW; RSTIN, PRES and CS are active HIGH.

δt1

t1t2

---------------

Fig.15 Definition of transition times.

handbook, full pagewidth

MGE741

10%

90% 90%

10%

trtf

t1t2

VOH

1/2 VCC

VOL

Contents

Main IC card interface TDA8002C Page 1999 Oct 12 4 BLOCK DIAGRAM TDA8002CG Fig.1 Block diagram. Page 1999 Oct 12 6 SYMBOL Fig.3 Pin configuration (TDA8002CT/B). Fig.2 Pin configuration (TDA8002CT/A). CT/C TYPE 1999 Oct 12 7 Fig.4 Pin configuration (TDA8002CT/C). Fig.5 Pin configuration (TDA8002CG). TDA8002CT/C Fig.4 Pin configuration (TDA8002CT/C). IC card interface TDA8002C 1999 Oct 12 9 Fig.6 ALARM as a function of VDD (tWpulse width minimum of 10 ms). Fig.7 Chip select. Page Page Page 1999 Oct 12 13 Fig.11 Activation sequence using CMDVCC, CLKDIV1 and CLKDIV2 signals to enable CLK. Fig.12 Activation sequence for synchronous application. Page Page Page Page Page Page Page Page 1999 Oct 12 22 80C51 TDA8002CT/C Fig.16 Application diagram. 1999 Oct 12 23 Application note AN98054 ). 1999 Oct 12 24 PACKAGE OUTLINES SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 1999 Oct 12 25 LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm SOT401-1 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Philips Semiconductors a worldwide company Printed in The Netherlands