1999 Oct 12 23

Philips Semiconductors Product specification
IC card interface TDA8002C

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FCE196
C8
10 µF
C3(2)
100 nF
C9
100 nF
C7
100 nF
C6(5)
470 nF

80C51

P1-0
P1-1
P1-2
P1-3
P1-4
P1-5
P1-6
P1-7
RST
P3-0
P3-1
P3-2
P3-3
P3-4
P3-5
P3-6
P3-7
XTAL2
XTAL1
VSS
VCC
P0-0
P0-1
P0-2
P0-3
P0-4
P0-5
P0-6
P0-7
EA
ALE
PSEN
P2-7
P2-6
P2-5
P2-4
P2-3
P2-2
P2-1
P2-0
IC2
IC1
VDD
VDD
28
27
26
25
24
23
22
21
30
29
38
37
36
35
34
33
32
31
40
39
1
2
3
4
5
15
6
7
8
9
10
16
17
18
19
20
11
12
13
14

TDA8002CG

C5I
C6I
C7I
C8I
C1I
C2I
C3I
C4I
C4
C3
C2
C1
C8
C7
C6
C5
(1) K1
K2
33 pF 33 pF
14.745 MHz
VDD
C2
10 µF
C1
100 nF
VDD
J1 1
3.3 V or 5 V
J1 2
ground
1
2
3
4
5
6
7
8
AUX1UC
STROBE
AUX2UC
CS
ALARM
CLKSEL
CLKDIV1
CLKDIV2
C4(3)
100 nF C5(4)
470 nF
24
23
22
21
20
19
18
17
AUX2
RST
CLK
VCC
AUX1
CMDVCC
CV/TV
PRES
910111213141516
CLKOUT
I/O
DGND1
AGND
S2
VUP
S1
VDDA
3231302928272625
VDDD
I/OUC
DGND2
XTAL2
XTAL1
MODE
RSTIN
OFF
CARD READ

Fig.17 Application diagram (for more details, see

“Application note AN98054”

).

TDA8002Cshould be placed as close as possible to the card reader.
(1) Contact normally open.
(2) C3 close to pin VCC of TDA8002C.
(3) C4 close to C1 contact of card reader.
(4) C5 close to VUP pin of TDA8002C.
(5) C6 as close as possible to pins S1 and S2.
CLK line may be shielded with respect to other lines.
Decoupling capacitorsC7, C8 and C9 may be placed as close as possible to pin VDDA and VDDD.
A good ground plane is recommended.