1999 Oct 12 25
Philips Semiconductors Product specification
IC card interface TDA8002C
0.2
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.60 0.15
0.05 1.5
1.3 0.25 0.27
0.17 0.18
0.12 5.1
4.9 0.5 7.15
6.85 1.0 0.95
0.55 7
0
o
o
0.12 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT401-1 95-12-19
97-08-04
D(1) (1)(1)
5.1
4.9
HD
7.15
6.85
E
Z
0.95
0.55
D
bp
e
E
B
8
D
H
bp
E
H
vMB
D
ZD
A
ZE
e
vMA
X
1
32
25
24 17
16
9
θ
A1
A
Lp
detail X
L
(A )
3
A2
y
wM
wM
0 2.5 5 mm
scale
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm SOT401-1
c
pin 1 index