Philips TDA8586

2001 Jul 23 17

Philips Semiconductors Preliminary speciﬁcation

Power ampliﬁer with load detection and

auto BTL/SE selection TDA8586

INTERNAL PIN CONFIGURATION

TDA8586TH NAME EQUIVALENT CIRCUIT

2, 3, 4, 5 and 6 inputs

11, 12, 14, 17,

19 and 20 outputs

8 mode select

handbook, halfpage

MGE014

handbook, halfpage

MGE015

OUT

0.5 VP

handbook, halfpage

MGE016

Contents

Main Page Page 2001 Jul 23 4 BLOCK DIAGRAM Fig.1 Block diagram SOT243-1. 2001 Jul 23 5 auto BTL/SE selection TDA8586 Fig.2 Block diagram SOT418-2 (HSOP20 heatsink up). auto BTL/SE selection TDA8586 2001 Jul 23 7 Fig.3 Pin configuration (SOT243-1). TDA8586Q Fig.4 Pin configuration (SOT418-2). TDA8586TH auto BTL/SE selection TDA8586 2001 Jul 23 9 Fig.5 Timing diagram including diagnostics. Page Page Page 2001 Jul 23 13 APPLICATION INFORMATION Fig.7 Stereo bridge-tied load application (SOT243-1). 2001 Jul 23 14 Fig.8 Quad single-ended application (SOT243-1). 2001 Jul 23 15 Fig.9 Stereo bridge-tied load application (SOT418-2). 2001 Jul 23 16 Fig.10 Quad single-ended application (SOT418-2). Page 2001 Jul 23 18 PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 2001 Jul 23 19 HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a w orldwide compan y Printed in The Netherlands