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Philips TDA8586 2001 Jul 23 7, Fig.3 Pin configuration (SOT243-1)., Fig.4 Pin configuration (SOT418-2).

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2001 Jul 23 7

Philips Semiconductors Preliminary speciﬁcation

Power ampliﬁer with load detection and

auto BTL/SE selection TDA8586

Fig.3 Pin configuration (SOT243-1).

handbook, halfpage

TDA8586Q

MGR025

OUT1

VP1

HVP1

OUT2

IN1

IN2

IN3

IN4

PGND1

PGND2

ACREF

DIAG

MSO

OUT4

HVP2

VP2

OUT3

Fig.4 Pin configuration (SOT418-2).

handbook, halfpage

n.c.

IN1

IN2

IN3

IN4

ACREF

DIAG

MSO

OVERRULE

DDDSEL

OUT2

HVP1

VP1

OUT1

PGND2

OUT3

PGND1

VP2

HVP2

OUT4

TDA8586TH

MGR026

Contents

Main Page Page 2001 Jul 23 4 BLOCK DIAGRAM Fig.1 Block diagram SOT243-1. 2001 Jul 23 5 auto BTL/SE selection TDA8586 Fig.2 Block diagram SOT418-2 (HSOP20 heatsink up). auto BTL/SE selection TDA8586 2001 Jul 23 7 Fig.3 Pin configuration (SOT243-1). TDA8586Q Fig.4 Pin configuration (SOT418-2). TDA8586TH auto BTL/SE selection TDA8586 2001 Jul 23 9 Fig.5 Timing diagram including diagnostics. Page Page Page 2001 Jul 23 13 APPLICATION INFORMATION Fig.7 Stereo bridge-tied load application (SOT243-1). 2001 Jul 23 14 Fig.8 Quad single-ended application (SOT243-1). 2001 Jul 23 15 Fig.9 Stereo bridge-tied load application (SOT418-2). 2001 Jul 23 16 Fig.10 Quad single-ended application (SOT418-2). Page 2001 Jul 23 18 PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 2001 Jul 23 19 HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a w orldwide compan y Printed in The Netherlands