Philips TDA8586 auto BTL/SE selection TDA8586

2001 Jul 23 5

Philips Semiconductors Preliminary speciﬁcation

Power ampliﬁer with load detection and

auto BTL/SE selection TDA8586

Fig.2 Block diagram SOT418-2 (HSOP20 heatsink up).

handbook, full pagewidth

MGR024

17 OUT1

ACREF 6

IN3 4

IN2 3

IN1 2

IN4 5

MSO 8

n.c. 1

V/I

−

20 OUT2

−

−19 HVP1

VPn

kΩ

V/I

−

kΩ

V/I

−

kΩ

14 OUT3

V/I

−

11 OUT4

7DIAG

−

−12 HVP2

kΩ

V/I

−

kΩ

BUFFER

VPn

30 kΩ

V/I

−

kΩ

INTERFACE DIAGNOSTIC

DDDSEL

OVERRULE

PGND2

VP1

VP2

PGND1

TDA8586TH

Contents

Main Page Page 2001 Jul 23 4 BLOCK DIAGRAM Fig.1 Block diagram SOT243-1. 2001 Jul 23 5 auto BTL/SE selection TDA8586 Fig.2 Block diagram SOT418-2 (HSOP20 heatsink up). auto BTL/SE selection TDA8586 2001 Jul 23 7 Fig.3 Pin configuration (SOT243-1). TDA8586Q Fig.4 Pin configuration (SOT418-2). TDA8586TH auto BTL/SE selection TDA8586 2001 Jul 23 9 Fig.5 Timing diagram including diagnostics. Page Page Page 2001 Jul 23 13 APPLICATION INFORMATION Fig.7 Stereo bridge-tied load application (SOT243-1). 2001 Jul 23 14 Fig.8 Quad single-ended application (SOT243-1). 2001 Jul 23 15 Fig.9 Stereo bridge-tied load application (SOT418-2). 2001 Jul 23 16 Fig.10 Quad single-ended application (SOT418-2). Page 2001 Jul 23 18 PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 2001 Jul 23 19 HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a w orldwide compan y Printed in The Netherlands