Philips TDA8586 specifications

DATA SH EET

Preliminary speciﬁcation

Supersedes data of 1999 Apr 08

File under Integrated Circuits, IC01

2001 Jul 23

INTEGRATED CIRCUITS

TDA8586

Power amplifier with load detection

and auto BTL/SE selection

Contents

Main Page Page 2001 Jul 23 4 BLOCK DIAGRAM Fig.1 Block diagram SOT243-1. 2001 Jul 23 5 auto BTL/SE selection TDA8586 Fig.2 Block diagram SOT418-2 (HSOP20 heatsink up). auto BTL/SE selection TDA8586 2001 Jul 23 7 Fig.3 Pin configuration (SOT243-1). TDA8586Q Fig.4 Pin configuration (SOT418-2). TDA8586TH auto BTL/SE selection TDA8586 2001 Jul 23 9 Fig.5 Timing diagram including diagnostics. Page Page Page 2001 Jul 23 13 APPLICATION INFORMATION Fig.7 Stereo bridge-tied load application (SOT243-1). 2001 Jul 23 14 Fig.8 Quad single-ended application (SOT243-1). 2001 Jul 23 15 Fig.9 Stereo bridge-tied load application (SOT418-2). 2001 Jul 23 16 Fig.10 Quad single-ended application (SOT418-2). Page 2001 Jul 23 18 PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 2001 Jul 23 19 HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a w orldwide compan y Printed in The Netherlands