Philips TDA8783 40 Msps, 10-bit analog-to-digital

2002 Oct 23 4

Philips Semiconductors Product speciﬁcation

40 Msps, 10-bit analog-to-digital

interface for CCD cameras TDA8783

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGM491

TRACK-

AND-HOLD TRACK-

AND-HOLD

TRACK-

AND-HOLD

CLAMP

ref1

CLAMP

8-BIT DAC

10-BIT DAC

9-BIT DAC

6 dB

AGC

CLOCK

GENERATOR

10-BIT ADC

REGULATOR SERIAL

INTERFACE

4-BIT DAC

CUT-OFF

OUTPUTS

BUFFER

13 15 16 17 18 20

2319 24

3738394041424344

454846

IND INP AGND3 SHD SHP CLPDM CLK DGND2 VCCO

VCCD2

VCCA3 OE

DGND1

OFDOUT

OGND

VCCD1

STDBY

SENAGND6

SCLK

SDATA

DEC1

VRT

VRB

VCCA2

DACOUT

Vref

CLPADC

AGND2

ADCIN

AGND5

VCCA1

AGCOUT

AGND4

AGND1

CPCDS

AMPOUT

TDA8783

4-BIT DAC

CUT-OFF

CLPOB

Contents

Main Page interface for CCD cameras TDA8783 2002 Oct 23 4 40 Msps, 10-bit analog-to-digital TDA8783 Fig.1 Block diagram. BLOCK DIAGRAM Page 2002 Oct 23 6 Fig.2 Pin configuration. SYMBOL PIN DESCRIPTION TDA8783HL Page interface for CCD cameras TDA8783 Page 40 Msps, 10-bit analog-to-digital Page 2002 Oct 23 12 Fig.3 Serial interface block diagram. Fig.4 Loading sequence of control DACs input data via the serial interface. Page 2002 Oct 23 14 Fig.5 Pixel frequency timing diagram. 2002 Oct 23 15 Fig.6 Line frequency timing diagram. 2002 Oct 23 16 Fig.7 AGC gain as a function of DAC input code. Fig.8 DAC voltage output as a function of DAC input code. 2002 Oct 23 17 Fig.9 Typical clamp current for pin CPCDS. Fig.11 Typical clamp current for pin Vref. Fig.10 Typical clamp current for pins IND and INP. 2002 Oct 23 18 Fig.12 CDS settling time and bandwidth. 2002 Oct 23 19 Fig.13 AGC bandwidth. Fig.14 CDS output. 2002 Oct 23 20 Fig.15 Output noise (RMS value). 2002 Oct 23 21 APPLICATION INFORMATION TDA8783 Fig.16 Application diagram. Page 2002 Oct 23 23 PACKAGE OUTLINE LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 Data Handbook IC26; Integrated Circuit Packages (LF)BGAApplication Note Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a worldwide company