Philips TDA8783 specifications

DATA SHEET

Product speciﬁcation

Supersedes data of 1999 Jun 25 2002 Oct 23

INTEGRATED CIRCUITS

TDA8783

40 Msps, 10-bit analog-to-digital

interface for CCD cameras

Contents

Main Page interface for CCD cameras TDA8783 2002 Oct 23 4 40 Msps, 10-bit analog-to-digital TDA8783 Fig.1 Block diagram. BLOCK DIAGRAM Page 2002 Oct 23 6 Fig.2 Pin configuration. SYMBOL PIN DESCRIPTION TDA8783HL Page interface for CCD cameras TDA8783 Page 40 Msps, 10-bit analog-to-digital Page 2002 Oct 23 12 Fig.3 Serial interface block diagram. Fig.4 Loading sequence of control DACs input data via the serial interface. Page 2002 Oct 23 14 Fig.5 Pixel frequency timing diagram. 2002 Oct 23 15 Fig.6 Line frequency timing diagram. 2002 Oct 23 16 Fig.7 AGC gain as a function of DAC input code. Fig.8 DAC voltage output as a function of DAC input code. 2002 Oct 23 17 Fig.9 Typical clamp current for pin CPCDS. Fig.11 Typical clamp current for pin Vref. Fig.10 Typical clamp current for pins IND and INP. 2002 Oct 23 18 Fig.12 CDS settling time and bandwidth. 2002 Oct 23 19 Fig.13 AGC bandwidth. Fig.14 CDS output. 2002 Oct 23 20 Fig.15 Output noise (RMS value). 2002 Oct 23 21 APPLICATION INFORMATION TDA8783 Fig.16 Application diagram. Page 2002 Oct 23 23 PACKAGE OUTLINE LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 Data Handbook IC26; Integrated Circuit Packages (LF)BGAApplication Note Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a worldwide company