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Philips TDA8783 2002 Oct 23 21, APPLICATION INFORMATION, Fig.16 Application diagram.

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2002 Oct 23 21

Philips Semiconductors Product speciﬁcation

40 Msps, 10-bit analog-to-digital

interface for CCD cameras TDA8783

APPLICATION INFORMATIONFig.16 Application diagram.

Depending on the application, the following connections must be made:

(1) The clamp level of the signal input at ADCIN can be tuned from code00 to code 511 in 0.5LSB steps of ADC via the serial interface

(clamp ADC activated).

(2) Clamp ADC not activated, direct connection from DACOUT to Vref.

(3) All supply pins must be decoupled with 100nF capacitors as close as possible to the device.

handbook, full pagewidth

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TDA8783

OGND

D9

D8

D7

D5

D4

D3

D2

D1

D0

DGND1

CLPOB

AGND4

OFDOUT

AMPOUT

AGND1

VCCA1

CPSDS

AGND5

CLPADC

Vref

D6

IND

INP

VCCA3

SHD

SHP

CLPDM

DGND2

VCCD2

OE

VCCO

AGND3

CLK

AGCOUT

ADCIN

AGND2

VCCA2

VRB

VRT

DEC1

AGND6

SDATA

SEN

STDBY

VCCD1

DACOUT

SCLK

from timing

generator

serial

interface

5.0 V 5.0 V

5.0 V

5.0 V

CCD 2.5 to 5.25 V

(3)

1 µF

1 µF

(3)

(3)

(2)

(1)

(3)

5.0 V

(3)

100

nF

1

nF

2.2

nF

1

nF

(3)

220

nF

Contents

Main Page interface for CCD cameras TDA8783 2002 Oct 23 4 40 Msps, 10-bit analog-to-digital TDA8783 Fig.1 Block diagram. BLOCK DIAGRAM Page 2002 Oct 23 6 Fig.2 Pin configuration. SYMBOL PIN DESCRIPTION TDA8783HL Page interface for CCD cameras TDA8783 Page 40 Msps, 10-bit analog-to-digital Page 2002 Oct 23 12 Fig.3 Serial interface block diagram. Fig.4 Loading sequence of control DACs input data via the serial interface. Page 2002 Oct 23 14 Fig.5 Pixel frequency timing diagram. 2002 Oct 23 15 Fig.6 Line frequency timing diagram. 2002 Oct 23 16 Fig.7 AGC gain as a function of DAC input code. Fig.8 DAC voltage output as a function of DAC input code. 2002 Oct 23 17 Fig.9 Typical clamp current for pin CPCDS. Fig.11 Typical clamp current for pin Vref. Fig.10 Typical clamp current for pins IND and INP. 2002 Oct 23 18 Fig.12 CDS settling time and bandwidth. 2002 Oct 23 19 Fig.13 AGC bandwidth. Fig.14 CDS output. 2002 Oct 23 20 Fig.15 Output noise (RMS value). 2002 Oct 23 21 APPLICATION INFORMATION TDA8783 Fig.16 Application diagram. Page 2002 Oct 23 23 PACKAGE OUTLINE LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 Data Handbook IC26; Integrated Circuit Packages (LF)BGAApplication Note Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a worldwide company