Appendix A. Expansion Headers

Appendix A. Expansion Headers

The M30260F8AGP MCU on the HTS Demo Kit target board is housed in a 48-pin QFP package. Pin 1 of the package is identified by the number ‘1’ on the board’s top silkscreen. The MCU_I/O solder pads, located below the “Renesas HTS Demo Board” sticker, provide access to some of the MCU’s pins. You can use MCU_I/O as test points to check MCU signals or, by mounting your own header, to connect your own external circuitry. The silkscreen identifying the connectors is at the top of the HTS Demo Kit board. The following table shows the mapping of MCU_I/O solder pads to MCU pins and signal names.

 

 

 

48

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MCU_I/O

 

QFP

 

 

 

 

 

 

 

 

MCU Function

 

 

Pin

 

MCU

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Vcc

11,46,

 

Vcc, VREF, AVcc

 

 

 

47

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AN4

40

 

P104/AN4/

 

 

 

 

 

 

 

 

 

KI0

 

AN5

39

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P105/AN5/ KI1

 

 

 

 

 

 

TxD2

25

P70/TxD2/ TA0OUT

 

RxD2

24

P71/RxD2/ TA0IN

 

CLK2

23

P72/CLK2/ TA1OUT/V

 

RTS2

22

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P73/ CTS2 / RTS2 / TA1IN/ V

 

 

 

 

 

 

ADTrg

36

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P15/INT3 / ADTRG / IDV

 

 

 

 

 

 

GND

9,44

 

Vss/AVss

HTS Demo Kit V1.0

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December 2007

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Renesas HEW Target user manual Appendix A. Expansion Headers, Mcui/O, MCU Function